DS34S108GN Maxim Integrated Products, DS34S108GN Datasheet - Page 5

• Manufacturer Part Number: DS34S108GN
• Description: Communication ICs - Various Octal TDM-Over-Packe t Transport Devices
• Manufacturer: Maxim Integrated Products
• Type: Transport Devicer

Specifications of DS34S108GN

• Mounting Style: SMD/SMT
• Operating Supply Voltage: 1.8 V, 3.3 V
• Supply Type: Analog
• Package / Case: HSBGA-484
• Data Rate: 100 Mbps
• Supply Voltage (max): 1.89 V, 3.465 V
• Supply Voltage (min): 1.71 V, 3.135 V
• Supply Current: 50 mA, 225 mA
• Maximum Operating Temperature: + 85 C
• Minimum Operating Temperature: - 40 C

ABRIDGED DATA SHEET
____________________________________________________ DS34S101, DS34S102, DS34S104, DS34S108
Figure 3-2. TDMoP in Cellular Backhaul
Other Possible Applications
Point-to-Multipoint TDM Connectivity over IP/Ethernet
The DS34S10x devices support NxDS0 TDMoP connections (known as bundles) with or without CAS (Channel
Associated Signaling). There is no need for an external TDM cross-connect, since the packet domain can be used
as a virtual cross-connect. Any bundle of timeslots can be directed to another remote location on the packet
domain.
HDLC Transport over IP/MPLS
TDM traffic streams often contain HDLC-based control channels and data traffic. These data streams, when
transported over a packet domain, should be treated differently than the time-sensitive TDM payload. DS34S10x
devices can terminate HDLC channels in the TDM streams and optionally map them into IP/MPLS/Ethernet for
transport. All HDLC-based control protocols (ISDN BRI and PRI, SS7 etc.) and all HDLC data traffic can be
managed and transported.
Using a Packet Backplane for Multiservice Concentrators
A communications device with all the above-mentioned capabilities can use a packet-based backplane instead of
the more expensive TDM bus option. This enables a cost-effective and future-proof design of communication
platforms with full support for both legacy and next-generation services.
Rev: 032609
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