IRF630 STMicroelectronics, IRF630 Datasheet - Page 3

MOSFET N-CH 200V 9A TO-220

IRF630

Manufacturer Part Number
IRF630
Description
MOSFET N-CH 200V 9A TO-220
Manufacturer
STMicroelectronics
Series
MESH OVERLAY™r
Type
Power MOSFETr
Datasheets

Specifications of IRF630

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
400 mOhm @ 4.5A, 10V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
9A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
45nC @ 10V
Input Capacitance (ciss) @ Vds
700pF @ 25V
Power - Max
75W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.4Ohm
Drain-source On-volt
200V
Gate-source Voltage (max)
±20V
Drain Current (max)
9A
Power Dissipation
75W
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-65C to 150C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
3 +Tab
Package Type
TO-220
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.4 Ohm @ 10 V
Forward Transconductance Gfs (max / Min)
4 S
Drain-source Breakdown Voltage
200 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
9 A
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 65 C
Application
High current switching, uninterruptible power supply (UPS), DC-AC converters for telecom, industrial and lighting equipment
Channel Type
N-Channel
Current, Drain
9 A
Fall Time
12 ns (Typ.)
Gate Charge, Total
31 nC
Mounting And Package Type
TO-220 Package
Operating And Storage Temperature
-65 to +150 °C
Polarization
N-Channel
Resistance, Drain To Source On
0.35 Ohm
Resistance, Thermal, Junction To Case
1.67 °C⁄W (Max.)
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-65 °C
Thermal Resistance, Junction To Ambient
62.5 °C⁄W
Time, Rise
15 ns (Typ.)
Time, Turn-on Delay
10 ns
Transconductance, Forward
4 S
Voltage, Breakdown, Drain To Source
200 V
Voltage, Drain To Gate
200 V
Voltage, Forward, Diode
1.5 V
Voltage, Gate To Source
±20 V
Rise Time
15 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-2757-5

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IRF630 - IRF630FP
1
Electrical ratings
Table 1.
1. Limited only by maximum temperature allowed
2. Pulse width limited by safe operating area
3. ISD ≤ 9A, di/dt ≤ 300A/µs, VDD ≤ V(BR)DSS, Tj ≤ TJMAX
Table 2.
Table 3.
Rthc-sink
Symbol
dv/dt
Symbol
R
Symbol
I
V
P
V
DM
R
V
thj-case
V
T
E
DGR
T
I
I
TOT
I
ISO
GS
thj-a
T
DS
stg
AR
D
D
AS
J
(2)
l
(3)
Absolute maximum ratings
Thermal data
Avalanche characteristics
Drain-source voltage (V
Drain-gate voltage (R
Gate-source voltage
Drain current (continuous) at T
Drain current (continuous) at T
Drain current (pulsed)
Total dissipation at T
Derating factor
Peak diode recovery voltage slope
Insulation winthstand voltage (DC)
Operating junction temperature
Storage temperature
Thermal resistance junction-case Max
Thermal resistance junction-ambient Max
Thermal resistance case-sink typ
Maximum lead temperature for soldering
purpose
Avalanche current, repetitive or not-repetitive
(pulse width limited by Tj Max)
Single pulse avalanche energy
(starting Tj=25°C, Id=Iar, Vdd=50V)
Parameter
Parameter
C
GS
= 25°C
Parameter
GS
= 20 kΩ)
= 0)
C
C
=100°C
= 25°C
TO-220
TO-220
5.7
0.6
36
75
1.67
--
9
-65 to 150
Value
Value
± 20
62.5
200
200
150
300
0.5
5
Value
160
TO-220FP
Electrical ratings
9
TO-220FP
5.7
2000
36
0.24
9
30
4.17
(1)
(1)
(1)
W/°C
°C/W
°C/W
°C/W
V/ns
Unit
Unit
Unit
°C
mJ
W
°C
V
V
V
V
A
A
A
A
3/14

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