IRFZ34NPBF International Rectifier, IRFZ34NPBF Datasheet - Page 2

MOSFET N-CH 55V 29A TO-220AB

IRFZ34NPBF

Manufacturer Part Number
IRFZ34NPBF
Description
MOSFET N-CH 55V 29A TO-220AB
Manufacturer
International Rectifier
Series
HEXFET®r
Type
Power MOSFETr
Datasheets

Specifications of IRFZ34NPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
40 mOhm @ 16A, 10V
Drain To Source Voltage (vdss)
55V
Current - Continuous Drain (id) @ 25° C
29A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
34nC @ 10V
Input Capacitance (ciss) @ Vds
700pF @ 25V
Power - Max
68W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.04Ohm
Drain-source On-volt
55V
Gate-source Voltage (max)
±20V
Drain Current (max)
29A
Power Dissipation
68W
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-55C to 175C
Operating Temperature Classification
Military
Mounting
Through Hole
Pin Count
3 +Tab
Package Type
TO-220AB
Current, Drain
29 A
Gate Charge, Total
34 nC
Polarization
N-Channel
Resistance, Drain To Source On
0.04 Ohm
Temperature, Operating, Maximum
+175 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
31 ns
Time, Turn-on Delay
7 ns
Transconductance, Forward
6.5 S
Voltage, Breakdown, Drain To Source
55 V
Voltage, Forward, Diode
1.6 V
Voltage, Gate To Source
±20 V
Transistor Polarity
N-Channel
Drain-source Breakdown Voltage
55 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
26 A
Mounting Style
Through Hole
Gate Charge Qg
22.7 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IRFZ34NPBF

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Electrical Characteristics @ T
IRFZ34NPbF
Source-Drain Ratings and Characteristics
Notes:
I
I
V
t
Q
t
V
∆V
R
V
g
I
I
Q
Q
Q
t
t
t
t
C
C
C
L
L
S
SM
on
DSS
d(on)
r
d(off)
f
rr
GSS
fs
S
(BR)DSS
GS(th)
D
SD
DS(ON)
iss
oss
rss
2
g
gs
gd
rr
(BR)DSS
Repetitive rating; pulse width limited by
V
R
max. junction temperature. ( See fig. 11 )
DD
G
= 25Ω, I
= 25V, starting T
/∆T
J
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Drain-to-Source Leakage Current
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Internal Source Inductance
Internal Drain Inductance
AS
= 16A. (See Figure 12)
J
= 25°C, L = 410µH
Parameter
Parameter
J
= 25°C (unless otherwise specified)
Pulse width ≤ 300µs; duty cycle ≤ 2%.
I
T
Min. Typ. Max. Units
Min. Typ. Max. Units
SD
–––
–––
–––
–––
––– 0.052 –––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
2.0
6.5
–––
55
J
Intrinsic turn-on time is negligible (turn-on is dominated by L
≤ 175°C
≤ 16 A, di/dt ≤ 420A/µs, V
–––
–––
–––
–––
–––
–––
–––
–––
–––
700
240
100
–––
130
––– 0.040
––– -100
7.5
–––
–––
7.0
4.5
49
31
40
57
–––
200
–––
–––
250
100
–––
–––
–––
–––
–––
–––
–––
–––
100
4.0
6.8
1.6
25
34
14
29
86
V/°C
nA
nH
µA
ns
nC
nC
pF
ns
A
V
V
V
S
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs
V
Reference to 25°C, I
V
V
V
V
V
V
V
I
V
V
V
I
R
R
Between lead,
6mm (0.25in.)
from package
and center of die contact
V
V
ƒ = 1.0MHz, See Fig. 5
D
D
J
J
GS
GS
DS
DS
DS
DS
GS
GS
DS
GS
DD
GS
DS
G
D
DD
= 16A
= 16A
= 25°C, I
= 25°C, I
= 1.8Ω, See Fig. 10
= 18Ω
= 10V, I
= V
= 25V, I
= 55V, V
= 44V, V
= 44V
= 10V, See Fig. 6 and 13
= 28V
= 0V
= 25V
= 0V, I
= 20V
= -20V
≤ V
GS
(BR)DSS
, I
D
S
F
D
D
D
Conditions
= 250µA
GS
GS
= 16A
Conditions
= 16A, V
= 250µA
= 16A
= 16A
,
= 0V
= 0V, T
D
www.irf.com
GS
= 1mA
J
G
= 150°C
= 0V
G
S
+L
D
S
S
D
D
)

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