NSPC221G50TRA1 NIC Components, NSPC221G50TRA1 Datasheet - Page 2

• Manufacturer Part Number: NSPC221G50TRA1
• Manufacturer: NIC Components

Specifications of NSPC221G50TRA1

• Tolerance (+ Or -): 2%
• Voltage: 50VDC
• Temp Coeff (dielectric): PLYPH
• Mounting Style: Surface Mount
• Construction: SMT Chip
• Failure Rate: Not Required
• Seated Plane Height: Not Requiredmm
• Product Diameter (mm): Not Requiredmm
• Product Height (mm): 0.8mm
• Product Depth (mm): 1.25mm
• Product Length (mm): 2mm
• Lead Spacing (nom): Not Requiredmm
• Lead Diameter (nom): Not Requiredmm
• Operating Temp Range: -55C to 125C
• Capacitance: 220pF
• Package / Case: 0805
• Lead Free Status / RoHS Status: Not Compliant

62
Stacked Film Capacitor Chips
STANDARD PRODUCTS AND SIZE CODE
NIC COMPONENTS CORP.
0.0012
0.0015
0.0022
0.0027
0.0033
0.0039
0.0047
0.0056
0.0068
0.0082
100pF
0.001
0.010
0.012
0.015
0.018
0.022
0.027
0.033
0.039
0.047
0.056
0.068
0.082
Cap.
0.10
0.12
0.15
0.18
0.22
120
150
180
220
270
330
390
470
560
680
820
®
Code
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
222
272
332
392
472
562
682
822
103
123
153
183
223
273
333
393
473
563
683
823
104
124
154
184
224
Working Voltage
C2
C2
C3
C3
A1
A1
A1
A1
A1
A2
A2
B1
B1
B1
B1
B2
B2
B3
B3
16
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
(Vdc)
C1
C1
C2
C2
C2
C3
C3
D1
D1
D1
D2
D2
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
A1
B1
B1
B1
B1
B1
B2
B2
E1
E3
E4
E5
50
www.niccomp.com
300
250
200
150
100
50
25
0
Solder within 1 year. Storage at +30°C and 60% RH
25°C ~ 150°C
90 sec. max.
RECOMMENDED REFLOW PROFILE
Ramp-up
www.lowESR.com
150°C ~ 180°C
120 sec. max.
DIMENSION (mm) AND CASE CODE
Pre-heat
Case
Code
A1
A2
B1
B2
B3
C1
C2
C3
D1
D2
E1
E3
E4
E5
p
Time
Stacked Element Terminations:
RECOMMENDED LAND PATTERN (mm)
EIA Size
Length
0805
1206
1210
1913
2416
L ±0.2
2.0
3.2
3.2
4.8
6.0
Time above 230°C
L
L
30 sec. max.
2
1
1.25 ± 0.2
1.0
2.2
2.2
2.6
3.8
1.6 ± 0.2
2.5 ± 0.2
3.3 ± 0.3
4.1 ± 0.3
www.RFpassives.com
A
Width
W
2.7
3.8
3.8
6.6
7.8
B
p
Peak Temperature
Cool Down
H ±0.2
Height
1.1
1.4
2.3
3.0
3.8
0.8
1.0
0.8
1.0
1.4
1.0
1.4
2.0
1.4
2.0
1.8
2.4
2.8
3.2
C
260°C
95.5% Sn, 4% Ag and
0.5% Cu over phosphorus
copper barrier over copper
base
W
0.45 ± 0.25
0.65 ± 0.35
0.65 ± 0.35
0.35 ± 0.20
0.35 ± 0.20
p
www.SMTmagnetics.com
A
B
H
NSPC Series
0805
1206
1210
1913
2416
EIA