STY60NM50 STMicroelectronics, STY60NM50 Datasheet

MOSFET N-CH 500V 60A MAX247

STY60NM50

Manufacturer Part Number
STY60NM50
Description
MOSFET N-CH 500V 60A MAX247
Manufacturer
STMicroelectronics
Series
MDmesh™r
Datasheet

Specifications of STY60NM50

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
50 mOhm @ 30A, 10V
Drain To Source Voltage (vdss)
500V
Current - Continuous Drain (id) @ 25° C
60A
Vgs(th) (max) @ Id
5V @ 250µA
Gate Charge (qg) @ Vgs
266nC @ 10V
Input Capacitance (ciss) @ Vds
7500pF @ 25V
Power - Max
560W
Mounting Type
Through Hole
Package / Case
MAX247™
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.05 Ohm @ 10 V
Drain-source Breakdown Voltage
500 V
Gate-source Breakdown Voltage
+/- 30 V
Continuous Drain Current
60 A
Power Dissipation
560000 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-2775-5

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
STY60NM50
Manufacturer:
ST
Quantity:
12 500
Part Number:
STY60NM50
Manufacturer:
ST
0
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Manufacturer:
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STY60NM50FD
Manufacturer:
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Part Number:
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Manufacturer:
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Quantity:
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Part Number:
STY60NM50��STY80NM60N
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DESCRIPTION
The MDmesh™ is a new revolutionary MOSFET
technology that associates the Multiple Drain pro-
cess with the Company’s PowerMESH™ horizontal
layout. The resulting product has an outstanding low
on-resistance, impressively high dv/dt and excellent
avalanche characteristics. The adoption of the
Company’s proprietary strip technique yields overall
dynamic performance that is significantly better than
that of similar competition’s products.
APPLICATIONS
The MDmesh™ family is very suitable for increasing
power density of high voltage converters allowing
system miniaturization and higher efficiencies.
ABSOLUTE MAXIMUM RATINGS
(•)Pulse width limited by safe operating area
November 2003
STY60NM50
V
TYPICAL R
HIGH dv/dt AND AVALANCHE CAPABILITIES
IMPROVED ESD CAPABILITY
LOW INPUT CAPACITANCE AND GATE
CHARGE
LOW GATE INPUT RESISTANCE
TIGHT PROCESS CONTROL
INDUSTRY’S LOWEST ON-RESISTANCE
Symbol
dv/dt (1)
ESD(G-S)
I
V
DM
P
V
V
T
DGR
TOT
I
I
T
stg
DS
GS
D
D
TYPE
j
( )
Drain-source Voltage (V
Drain-gate Voltage (R
Gate- source Voltage
Drain Current (continuous) at T
Drain Current (continuous) at T
Drain Current (pulsed)
Total Dissipation at T
Gate source ESD(HBM-C=100pF, R=15K
Derating Factor
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
DS
(on) = 0.045
V
500V
DSS
< 0.05
R
Zener-Protected MDmesh™Power MOSFET
DS(on)
C
GS
Parameter
= 25°C
N-CHANNEL 500V - 0.045 - 60A Max247
GS
= 20 k )
= 0)
C
C
60 A
= 25°C
= 100°C
I
D
(1)I
SD
INTERNAL SCHEMATIC DIAGRAM
60A, di/dt 400A/µs, V
Max247
–65 to 150
DD
STY60NM50
Value
37.8
500
500
±30
240
560
150
4.5
60
15
6
V
(BR)DSS
1
2
3
, T
j
T
JMAX
W/°C
V/ns
Unit
KV
°C
°C
W
V
V
V
A
A
A
1/8

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STY60NM50 Summary of contents

Page 1

... November 2003 N-CHANNEL 500V - 0.045 - 60A Max247 Zener-Protected MDmesh™Power MOSFET R I DS(on) D < 0. Parameter = 25° 100° 25°C C (1)I SD STY60NM50 Max247 INTERNAL SCHEMATIC DIAGRAM Value 500 500 ±30 60 37.8 240 560 6 4.5 15 –65 to 150 150 60A, di/dt 400A/µ ...

Page 2

... STY60NM50 THERMAL DATA Rthj-case Thermal Resistance Junction-case Rthj-amb Thermal Resistance Junction-ambient T Maximum Lead Temperature For Soldering Purpose l AVALANCHE CHARACTERISTICS Symbol I Avalanche Current, Repetitive or Not-Repetitive AR (pulse width limited Single Pulse Avalanche Energy AS (starting ° ELECTRICAL CHARACTERISTICS (TCASE = 25 °C UNLESS OTHERWISE SPECIFIED) OFF ...

Page 3

... Figure 5) Test Conditions I = 60A 60A, di/dt = 100A/µ 100 25° (see test circuit, Figure 60A, di/dt = 100A/µ 100 150° (see test circuit, Figure 5) Thermal Impedance STY60NM50 Min. Typ. Max. Unit 190 266 Min. Typ. Max. Unit 108 ns Min ...

Page 4

... STY60NM50 Output Characteristics Transconductance Gate Charge vs Gate-source Voltage 4/8 Transfer Characteristics Static Drain-source On Resistance Capacitance Variations ...

Page 5

... Normalized Gate Threshold Voltage vs Temp. Source-drain Diode Forward Characteristics Normalized On Resistance vs Temperature STY60NM50 5/8 ...

Page 6

... STY60NM50 Fig. 1: Unclamped Inductive Load Test Circuit Fig. 3: Switching Times Test Circuit For Resistive Load Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/8 Fig. 2: Unclamped Inductive Waveform Fig. 4: Gate Charge test Circuit ...

Page 7

... Max247 MECHANICAL DATA mm DIM. MIN. TYP. A 4.70 A1 2.20 b 1.00 b1 2.00 b2 3.00 c 0.40 D 19.70 e 5.35 E 15.30 L 14.20 L1 3.70 inch MAX. MIN. TYP. 5.30 2.60 1.40 2.40 3.40 0.80 20.30 5.55 15.90 15.20 4.30 STY60NM50 MAX. P025Q 7/8 ...

Page 8

... STY60NM50 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice ...

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