ZXMP3A16GTA Diodes Zetex, ZXMP3A16GTA Datasheet - Page 8

• Manufacturer Part Number: ZXMP3A16GTA
• Description: MOSFET P-CH 30V 4.6A SOT223
• Manufacturer: Diodes Zetex
• Type: Power MOSFETr

Specifications of ZXMP3A16GTA

• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 45 mOhm @ 4.2A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 5.4A
• Vgs(th) (max) @ Id: 1V @ 250µA
• Gate Charge (qg) @ Vgs: 29.6nC @ 10V
• Input Capacitance (ciss) @ Vds: 1022pF @ 15V
• Power - Max: 2W
• Mounting Type: Surface Mount
• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Number Of Elements: 1
• Polarity: P
• Channel Mode: Enhancement
• Drain-source On-res: 0.045Ohm
• Drain-source On-volt: 30V
• Gate-source Voltage (max): ±20V
• Continuous Drain Current: 7.5A
• Power Dissipation: 3.9W
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3 +Tab
• Package Type: SOT-223
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: ZXMP3A16GTR

PACKAGE OUTLINE
PACKAGE DIMENSIONS
© Zetex Semiconductors plc 2007
Europe
Zetex GmbH
Kustermann-Park
Balanstraße 59
D-81541 München
Germany
Telefon: [phone]
Fax: [phone]
[e-mail]
ZXMP3A16G
DIM
A1
b2
A
D
b
C
0.02
0.66
2.90
0.23
6.30
Min
Millimeters
-
Max
1.80
0.10
0.84
3.10
0.33
6.70
0.0008
0.026
0.114
0.009
0.248
Min
-
Americas
Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY 11788
USA
Telephone: [phone]
Fax: [phone]
[e-mail]
Inches
0.071
0.004
0.033
0.122
0.013
0.264
Max
DIM
e1
E1
e
E
L
-
6.70
3.30
0.90
Min
Millimeters
-
2.30 BSC
4.60 BSC
8
Asia Pacific
Zetex (Asia) Ltd
3701-04 Metroplaza Tower 1
Hing Fong Road, Kwai Fong
Hong Kong
Telephone: [phone]
Fax: [phone]
[e-mail]
PAD LAYOUT DETAILS
Max
7.30
3.70
-
-
0.264
0.130
0.355
Min
0.0905 BSC
0.181 BSC
-
Inches
0.287
0.146
Max
-
-
Corporate Headquarters
Zetex Semiconductors plc
Zetex Technology Park
Chadderton, Oldham, OL9 9LL
United Kingdom
Telephone [phone]
Fax: [phone]
[e-mail]
ISSUE 3 - MAY 2007