IRF5804TRPBF International Rectifier, IRF5804TRPBF Datasheet

MOSFET P-CH 40V 2.5A 6-TSOP

IRF5804TRPBF

Manufacturer Part Number
IRF5804TRPBF
Description
MOSFET P-CH 40V 2.5A 6-TSOP
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF5804TRPBF

Package / Case
Micro6™(TSOP-6)
Mounting Type
Surface Mount
Power - Max
2W
Fet Type
MOSFET P-Channel, Metal Oxide
Gate Charge (qg) @ Vgs
8.5nC @ 10V
Vgs(th) (max) @ Id
3V @ 250µA
Current - Continuous Drain (id) @ 25° C
2.5A
Drain To Source Voltage (vdss)
40V
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
198 mOhm @ 2.5A, 10V
Transistor Polarity
P Channel
Continuous Drain Current Id
2.5A
Drain Source Voltage Vds
40V
On Resistance Rds(on)
198mohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
-3V
Rohs Compliant
Yes
Resistance Drain-source Rds (on)
334 mOhms
Drain-source Breakdown Voltage
- 40 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
- 2.5 A
Power Dissipation
2 W
Mounting Style
SMD/SMT
Gate Charge Qg
5.7 nC
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF5804TRPBF
Manufacturer:
IR
Quantity:
20 000
Description
l
l
l
l
l
Thermal Resistance
These P-channel HEXFET
International Rectifier utilize advanced processing
techniques to achieve the extremely low on-resistance
per silicon area. This benefit provides the designer
with an extremely efficient device for use in battery and
load management applications.
The TSOP-6 package with its customized leadframe
produces a HEXFET
60% less than a similar size SOT-23. This package is
ideal for applications where printed circuit board space
is at a premium. It's unique thermal design and R
reduction enables a current-handling increase of nearly
300% compared to the SOT-23.
www.irf.com
R
V
I
I
I
P
P
V
T
D
D
DM
J,
DS
D
D
GS
θJA
@ T
@ T
Ultra Low On-Resistance
P-Channel MOSFET
Surface Mount
Available in Tape & Reel
Low Gate Charge
@T
@T
T
STG
A
A
A
A
= 70°C
= 25°C
= 25°C
= 70°C
Maximum Junction-to-Ambient
Drain- Source Voltage
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current 
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Junction and Storage Temperature Range
®
power MOSFET with R
®
Power MOSFETs from
Parameter
Parameter
ƒ
ƒ
GS
GS
ƒ
DS(on)
DS(on)
@ -10V
@ -10V
G
D
D
V
-40V
DSS
1
3
2
Top View
R
HEXFET
6
5
4
DS(on)
-55 to + 150
198@V
334@V
Max.
Max.
0.016
62.5
D
S
D
-2.5
-2.0
± 20
A
-40
-10
2.0
1.3
max (mW)
GS
GS
®
IRF5804
= -10V
= -4.5V
Power MOSFET
TSOP-6
PD - 94333B
-2.5A
-2.0A
mW/°C
Units
Units
I
°C/W
D
°C
V
A
V
1
3/17/05

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IRF5804TRPBF Summary of contents

Page 1

... Description ® These P-channel HEXFET Power MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications. The TSOP-6 package with its customized leadframe ® ...

Page 2

Parameter V Drain-to-Source Breakdown Voltage (BR)DSS ∆V Breakdown Voltage Temp. Coefficient /∆T (BR)DSS J V Gate Threshold Voltage GS(th) g Forward Transconductance fs Gate-to-Source Forward Leakage Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge gs Q Gate-to-Drain ...

Page 3

VGS TOP -10V -7.0V -5.0V -4.5V -4.0V 10 -3.7V -3.5V BOTTOM -3.0V 1 -3.0V 0.1 20µs PULSE WIDTH Tj = 25°C 0.01 0 Drain-to-Source Voltage (V) Fig 1. Typical Output Characteristics 10. ...

Page 4

0V MHZ C iss = rss = oss = 1000 Ciss 100 Coss Crss 10 1 ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 100 D = 0.50 0.20 10 0.10 0.05 0.02 0.01 SINGLE PULSE 1 (THERMAL RESPONSE) ...

Page 6

-2.5A 0.15 0.10 4.0 5.0 6.0 7.0 -V GS, Gate -to -Source Voltage (V) Fig 12. Typical On-Resistance Vs. Gate Voltage Charge Fig 14a. ...

Page 7

Temperature ( °C ) Fig 15. Typical Threshold Voltage Vs. Junction Temperature www.irf.com -250µ 100 ...

Page 8

8 www.irf.com ...

Page 9

Notes : T his part marking information applies to devices produced before 02/26/2001 EXAMPLE: T HIS I3443DV PART NUMBER WAFER LOT NUMBER CODE PART NUMBER CODE REFERENCE SI3443DV 3B = IRF5800 3C = IRF5850 3D ...

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