IRFL4310PBF International Rectifier, IRFL4310PBF Datasheet - Page 2

MOSFET N-CH 100V 1.6A SOT223

IRFL4310PBF

Manufacturer Part Number
IRFL4310PBF
Description
MOSFET N-CH 100V 1.6A SOT223
Manufacturer
International Rectifier
Series
HEXFET®r
Type
Power MOSFETr
Datasheets

Specifications of IRFL4310PBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
200 mOhm @ 1.6A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
1.6A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
25nC @ 10V
Input Capacitance (ciss) @ Vds
330pF @ 25V
Power - Max
1W
Mounting Type
Surface Mount
Package / Case
SOT-223 (3 leads + Tab), SC-73, TO-261
Current, Drain
1.6 A
Gate Charge, Total
17 nC
Package Type
SOT-223
Polarization
N-Channel
Power Dissipation
1 W
Resistance, Drain To Source On
0.2 Ohm
Temperature, Operating, Maximum
+150 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
34 ns
Time, Turn-on Delay
7.8 ns
Transconductance, Forward
1.5 S
Voltage, Breakdown, Drain To Source
100 V
Voltage, Forward, Diode
1.3 V
Voltage, Gate To Source
±20 V
Number Of Elements
1
Polarity
N
Channel Mode
Enhancement
Drain-source On-res
0.2Ohm
Drain-source On-volt
100V
Gate-source Voltage (max)
±20V
Continuous Drain Current
2.2A
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3 +Tab
Configuration
Single Dual Drain
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.2 Ohms
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
20 V
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Fall Time
20 ns
Gate Charge Qg
17 nC
Minimum Operating Temperature
- 55 C
Rise Time
18 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IRFL4310PBF

IRFL4310PbF
Electrical Characteristics @ T
Source-Drain Ratings and Characteristics
Notes:
I
I
I
V
t
Q
I
R
GSS
V
∆V
V
g
Q
Q
Q
t
t
t
t
C
C
C
S
SM
DSS
rr
d(on)
r
d(off)
f
SD
V
fs
rr
Repetitive rating; pulse width limited by
max. junction temperature. ( See fig. 11 )
(BR)DSS
DS(on)
GS(th)
iss
oss
rss
g
gs
gd
2
R
(BR)DSS
DD
G
= 25V, starting T
= 25Ω, I
/∆T
J
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode) 
Diode Forward Voltage
Reverse Recovery Time
Reverse RecoveryCharge
Drain-to-Source Leakage Current
Static Drain-to-Source On-Resistance
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Gate Threshold Voltage
Forward Transconductance
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
AS
Fall Time
= 3.2A. (See Figure 12)
J
= 25°C, L = 9.2 mH
Parameter
Parameter
J
= 25°C (unless otherwise specified)
ƒ
–––
T
Pulse width ≤ 300µs; duty cycle ≤ 2%.
I
SD
Min. Typ. Max. Units
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
100
–––
–––
–––
–––
–––
–––
Min. Typ. Max. Units
2.0
1.5
J
≤ 150°C
≤ 1.6A, di/dt ≤ 340A/µs, V
20
–––
–––
–––
210
0.12
––– 0.20
–––
–––
–––
–––
––– -100
330
–––
–––
72
2.1
7.8
7.8
17
18
34
92
54
–––
110
320
1.3
–––
250
100
–––
–––
–––
–––
–––
0.91
–––
–––
4.0
3.1
–––
25
12
13
25
V/°C
nC
ns
nC
µA
nA
pF
V
ns
A
V
V
S
R
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs „
D
V
Reference to 25°C, I
V
V
V
V
V
V
V
I
V
V
V
I
R
V
V
ƒ = 1.0MHz, See Fig. 5
D
D
J
J
DD
GS
GS
DS
DS
DS
DS
GS
GS
DS
GS
DD
GS
DS
G
= 31 Ω, See Fig. 10 „
= 25°C, I
= 25°C, I
= 1.6A
= 1.6A
= 6.2 Ω
≤ V
= 100V, V
= 0V, I
= V
= 50V, I
= 80V, V
= 80V
= 25V
= 10V, I
= 20V
= -20V
= 10V, See Fig. 6 and 13 „
= 0V
= 50V
(BR)DSS
GS
, I
D
S
F
Conditions
D
D
D
= 250µA
Conditions
= 1.6A, V
= 1.6A
GS
= 250µA
= 0.80 A
GS
,
= 1.6A „
= 0V, T
= 0V
D
www.irf.com
= 1mA
GS
J
= 125°C
= 0V „

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