IRF540NSPBF International Rectifier, IRF540NSPBF Datasheet

MOSFET N-CH 100V 33A D2PAK

IRF540NSPBF

Manufacturer Part Number
IRF540NSPBF
Description
MOSFET N-CH 100V 33A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheets

Specifications of IRF540NSPBF

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
44 mOhm @ 16A, 10V
Drain To Source Voltage (vdss)
100V
Current - Continuous Drain (id) @ 25° C
33A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
71nC @ 10V
Input Capacitance (ciss) @ Vds
1960pF @ 25V
Power - Max
130W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Current, Drain
33 A
Gate Charge, Total
71 nC
Package Type
D2Pak
Polarization
N-Channel
Power Dissipation
130 W
Resistance, Drain To Source On
44 Milliohms
Temperature, Operating, Maximum
+175 °C
Temperature, Operating, Minimum
-55 °C
Time, Turn-off Delay
39 ns
Time, Turn-on Delay
11 ns
Transconductance, Forward
21 S
Voltage, Breakdown, Drain To Source
100 V
Voltage, Forward, Diode
1.2 V
Voltage, Gate To Source
±20 V
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
44 m Ohms
Drain-source Breakdown Voltage
100 V
Gate-source Breakdown Voltage
20 V
Continuous Drain Current
33 A
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Fall Time
35 ns
Gate Charge Qg
47.3 nC
Minimum Operating Temperature
- 55 C
Rise Time
35 ns
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
*IRF540NSPBF

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF540NSPBF
Manufacturer:
IR
Quantity:
21 400
Part Number:
IRF540NSPBF
Manufacturer:
IR
Quantity:
20 000
Part Number:
IRF540NSPBF
Quantity:
180
Thermal Resistance
l
l
l
l
l
l
l
Absolute Maximum Ratings
Advanced HEXFET
International Rectifier utilize advanced processing
techniques to achieve extremely low on-resistance per
silicon area.
switching speed and ruggedized device design that
HEXFET power MOSFETs are well known for, provides
the designer with an extremely efficient and reliable
device for use in a wide variety of applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
its low internal connection resistance and can dissipate up
to 2.0W in a typical surface mount application.
The through-hole version (IRF540NL) is available for low-
profile applications.
www.irf.com
Description
I
I
I
P
V
I
E
dv/dt
T
T
R
R
D
D
DM
AR
2
J
STG
D
GS
AR
θJC
θJA
Pak is suitable for high current applications because of
@ T
@ T
Advanced Process Technology
Ultra Low On-Resistance
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
Lead-Free
@T
2
Pak is a surface mount power package capable of
C
C
C
= 25°C
= 100°C
= 25°C
This benefit, combined with the fast
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Junction-to-Ambient (PCB mount)**
®
Power MOSFETs from
Parameter
Parameter

‡
ƒ‡
GS
GS

@ 10V
@ 10V
G
Typ.
300 (1.6mm from case )
IRF540NSPbF
–––
–––
IRF540NLPbF
10 lbf•in (1.1N•m)
HEXFET
IRF540NSPbF
-55 to + 175
S
D
D
Max.
0.87
110
130
± 20
7.0
2
33
23
16
13
Pak
®
R
Power MOSFET
V
Max.
DS(on)
1.15
40
DSS
I
IRF540NLPbF
D
= 33A
TO-262
= 100V
PD - 95130
= 44mΩ
Units
Units
°C/W
W/°C
V/ns
mJ
°C
W
A
V
A
1

Related parts for IRF540NSPBF

IRF540NSPBF Summary of contents

Page 1

... Typ 95130 IRF540NLPbF ® HEXFET Power MOSFET 100V DSS R = 44mΩ DS(on 33A Pak TO-262 IRF540NSPbF IRF540NLPbF Max. Units 110 130 W 0.87 W/°C ± 7.0 V/ns - 175 °C 10 lbf•in (1.1N•m) Max. Units – ...

Page 2

Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient ∆V /∆T (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage ...

Page 3

VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 100 4.5V 10 20µs PULSE WIDTH 0 Drain-to-Source Voltage (V) DS Fig 1. Typical Output Characteristics 1000 T = ...

Page 4

1MHz iss rss gd 2500 oss iss 2000 1500 1000 C oss 500 ...

Page 5

T , Case Temperature ( C) C Fig 9. Maximum Drain Current Vs. Case Temperature 0.50 0.20 0.10 0.1 0.05 SINGLE PULSE 0.02 ...

Page 6

D.U 20V 0.01 Ω Charge 6 400 15V DRIVER 300 + 200 A 100 V ...

Page 7

D.U.T + ‚ -  Driver Gate Drive D.U.T. I Reverse Recovery Current D.U.T. V Re-Applied Voltage Inductor Curent www.irf.com + • • ƒ • • • • Period D = P.W. Waveform SD Body Diode Forward Current ...

Page 8

Dimensions are shown in millimeters (inches ...

Page 9

TO-262 Package Outline TO-262 Part Marking Information EXAMPLE: T HIS IS AN IRL3103L LOT CODE 1789 AS SEMBLED ON WW 19, 1997 ASS EMBLY LINE "C" Note: "P" embly line pos ition indicates "Lead-Free" ...

Page 10

D Pak Tape & Reel Infomation Dimensions are shown in millimeters (inches) TRR FEED DIRECTION TRL FEED DIRECTION 330.00 (14.173) MAX. NOTES : 1. COMFORMS TO EIA-418. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION MEASURED @ HUB. 4. INCLUDES FLANGE ...

Page 11

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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