IRF6616 International Rectifier, IRF6616 Datasheet - Page 3

• Manufacturer Part Number: IRF6616
• Description: MOSFET N-CH 30V 19A DIRECTFET
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRF6616

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 5 mOhm @ 19A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 19A
• Vgs(th) (max) @ Id: 2.25V @ 250µA
• Gate Charge (qg) @ Vgs: 44nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 3765pF @ 20V
• Power - Max: 2.8W
• Mounting Type: Surface Mount
• Package / Case: DirectFET™ Isometric MX
• Configuration: Single Quad Drain Dual Source
• Transistor Polarity: N-Channel
• Resistance Drain-source Rds (on): 5 m Ohms
• Drain-source Breakdown Voltage: 100 V
• Gate-source Breakdown Voltage: +/- 30 V
• Continuous Drain Current: 19 A
• Power Dissipation: 2.8 W
• Maximum Operating Temperature: + 150 C
• Mounting Style: Through Hole
• Fall Time: 4.4 ns
• Minimum Operating Temperature: - 40 C
• Rise Time: 19 ns
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant


‚
ƒ
board (still air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
 Surface mounted on 1 in. square Cu
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Mounted on minimum footprint full size board with metalized
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.001
0.01
100
0.1
10
1
1E-006
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
D = 0.50
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
0.05
0.02
0.20
0.10
0.01
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
0.0001
fg
f
dg
eg
g
Parameter
Parameter
Ã
t 1 , Rectangular Pulse Duration (sec)
0.001
small clip heatsink (still air)
ƒ

τ
J
τ
J
τ
„
…
1
Ci= τi/Ri
τ
1
Ci
R
T
0.01
C
θ
i/Ri
R
is measured at
measured with thermocouple incontact with top (Drain) of part.
1
R
1
τ
2
R
τ
2
2
R
2
0.1
with
R
τ
3
3
R
τ
J
3
3
Typ.
12.5
–––
–––
1.0
20
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
τ
R
4
τ
4
-40 to + 150
R
4
4
1
τ
A
Max.
0.022
footprint full size board with
metalized back and with
small clip heatsink (still air)
τ
270
ƒ Mounted on minimum
2.8
1.8
A
89
Ri (°C/W) τi (sec)
1.2801
8.7256
21.750
13.251
Max.
–––
–––
–––
1.4
45
10
69
0.000322
0.164798
2.25760
100
Units
Units
°C/W
W/°C
°C
W
3