NTD5407NT4G ON Semiconductor, NTD5407NT4G Datasheet - Page 2

MOSFET N-CH 40V 38A DPAK

NTD5407NT4G

Manufacturer Part Number
NTD5407NT4G
Description
MOSFET N-CH 40V 38A DPAK
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTD5407NT4G

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
26 mOhm @ 20A, 10V
Drain To Source Voltage (vdss)
40V
Current - Continuous Drain (id) @ 25° C
38A
Vgs(th) (max) @ Id
3.5V @ 250µA
Gate Charge (qg) @ Vgs
20nC @ 10V
Input Capacitance (ciss) @ Vds
1000pF @ 32V
Power - Max
75W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
0.026 Ohms
Forward Transconductance Gfs (max / Min)
15 S
Drain-source Breakdown Voltage
40 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
38 A
Power Dissipation
75 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD5407NT4G
Manufacturer:
ON
Quantity:
12 500
Part Number:
NTD5407NT4G
Manufacturer:
ON/安森美
Quantity:
20 000
2. Pulse Test: pulse width ≤ 300 ms, duty cycle ≤ 2%.
3. Switching characteristics are independent of operating junction temperatures.
ELECTRICAL CHARACTERISTICS
OFF CHARACTERISTICS
ON CHARACTERISTICS (Note 2)
CHARGES AND CAPACITANCES
SWITCHING CHARACTERISTICS, V
SWITCHING CHARACTERISTICS, V
DRAIN−SOURCE DIODE CHARACTERISTICS (Note 2)
Drain−to−Source Breakdown Voltage
Drain−to−Source Breakdown Voltage
Temperature Coefficient
Zero Gate Voltage Drain Current
Gate−to−Source Leakage Current
Gate Threshold Voltage
Gate Threshold Temperature
Coefficient
Drain−to−Source On Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate−to−Source Charge
Gate−to−Drain Charge
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
Turn−On Delay Time
Rise Time
Turn−Off Delay Time
Fall Time
Forward Diode Voltage
Reverse Recovery Time
Charge Time
Discharge Time
Reverse Recovery Charge
Parameter
GS
GS
V
= 10 V (Note 3)
= 5 V (Note 3)
V
(T
V
(BR)DSS
Symbol
V
GS(TH)
Q
R
t
t
(BR)DSS
J
C
C
t
t
d(OFF)
d(OFF)
GS(TH)
I
I
C
G(TOT)
Q
Q
Q
DS(on)
d(ON)
d(ON)
V
g
DSS
GSS
t
= 25°C unless otherwise stated)
OSS
RSS
RR
t
t
FS
ISS
t
t
t
t
GS
GD
SD
RR
a
b
r
f
r
f
/T
/T
J
J
V
http://onsemi.com
GS
V
V
V
V
V
V
I
V
V
V
V
DS
S
GS
GS
V
GS
GS
V
V
I
I
GS
DS
GS
GS
D
D
= 0 V, dI
GS
= 5.0 A
GS
GS
GS
= 0 V,
= 40 V
= 38 A, R
= 20 A, R
= 0 V,
Test Condition
= 10 V, V
= 10 V, V
= 0 V, f = 1.0 MHz,
= 0 V, V
= V
= 5 V, V
= 0 V, I
= 5.0 V, I
= 10 V, I
= 10 V, I
V
I
I
DS
D
S
DS
2
= 38 A
= 15 A
S
, I
= 32 V
/dt = 100 A/ms,
D
GS
D
DD
G
G
DD
DS
= 250 mA
D
D
D
= 250 mA
= 2.5 W
= 2.5 W
= ±30 V
T
= 20 A
= 18 A
= 20 V,
T
= 10 A
= 32 V,
= 32 V,
T
T
J
J
J
J
= 100°C
= 125°C
= 25°C
= 25°C
Min
1.5
40
−6.0
2.25
10.5
0.75
20.5
Typ
615
173
175
6.8
0.9
39
21
32
15
80
20
17
66
51
10
13
23
38
17
40
±100
1000
Max
1.0
3.5
1.1
10
26
40
mV/°C
mV/°C
Unit
mW
mA
nA
pF
nC
nC
ns
ns
ns
V
V
S
V

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