NTD20P06LG ON Semiconductor, NTD20P06LG Datasheet

MOSFET P-CH 60V 15.5A DPAK

NTD20P06LG

Manufacturer Part Number
NTD20P06LG
Description
MOSFET P-CH 60V 15.5A DPAK
Manufacturer
ON Semiconductor
Type
Power MOSFETr
Datasheets

Specifications of NTD20P06LG

Fet Type
MOSFET P-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
150 mOhm @ 7.5A, 5V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
15.5A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
26nC @ 5V
Input Capacitance (ciss) @ Vds
1190pF @ 25V
Power - Max
65W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Configuration
Single
Transistor Polarity
P-Channel
Resistance Drain-source Rds (on)
0.13 Ohms
Forward Transconductance Gfs (max / Min)
17.5 S
Drain-source Breakdown Voltage
- 60 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
- 15.5 A
Power Dissipation
65 W
Maximum Operating Temperature
+ 175 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 55 C
Number Of Elements
1
Polarity
P
Channel Mode
Enhancement
Drain-source On-res
0.15Ohm
Drain-source On-volt
60V
Gate-source Voltage (max)
±20V
Output Power (max)
Not RequiredW
Frequency (max)
Not RequiredMHz
Noise Figure
Not RequireddB
Power Gain
Not RequireddB
Drain Efficiency
Not Required%
Operating Temp Range
-55C to 175C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
2 +Tab
Package Type
DPAK
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
NTD20P06LG
NTD20P06LGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTD20P06LG
Manufacturer:
ON
Quantity:
872
Part Number:
NTD20P06LG
Manufacturer:
ON
Quantity:
12 500
Part Number:
NTD20P06LG
Manufacturer:
ON
Quantity:
12 500
NTD20P06L
Power MOSFET
−60 V, −15.5 A, Single P−Channel, DPAK
Features
Applications
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Surface−mounted on FR4 board using 1 in sq. pad size
2. Surface−mounted on FR4 board using the minimum recommended pad size
© Semiconductor Components Industries, LLC, 2011
April, 2011 − Rev. 5
MAXIMUM RATINGS
THERMAL RESISTANCE RATINGS
Drain−to−Source Voltage
Gate−to−Source
Voltage
Continuous
Drain Current
(Note 1)
Power Dissipa-
tion (Note 1)
Pulsed Drain
Current
Operating Junction and Storage Temperature
Single Pulse Drain−to−Source Avalanche
Energy (V
L = 2.7 mH, R
Lead Temperature for Soldering Purposes
(1/8” from case for 10 s)
Junction−to−Case (Drain)
Junction−to−Ambient – Steady State (Note 1)
Junction−to−Ambient – Steady State (Note 2)
Withstands High Energy in Avalanche and Commutation Modes
Low Gate Charge for Fast Switching
These are Pb−Free Devices
Bridge Circuits
Power Supplies, Power Motor Controls
DC−DC Conversion
(Cu area = 1.127 in sq. [1 oz] including traces)
(Cu area = 0.412 in sq.)
DD
= 25 V, V
G
= 25 W)
Parameter
Parameter
Non−Repetitive
Steady State
Steady State
GS
(T
= 5 V, I
J
Continuous
= 25°C unless otherwise noted)
t
p
= 10 ms
PK
= 15 A,
t
T
T
p
A
A
v10 ms
= 25°C
= 25°C
Symbol
Symbol
V
V
T
R
R
R
V
E
I
GSM
P
T
STG
T
DSS
DM
I
qJC
qJA
qJA
GS
D
AS
J
D
L
,
−55 to
Value
−15.5
$20
$30
$50
Max
−60
175
304
260
110
2.3
65
80
1
°C/W
Unit
Unit
mJ
°C
°C
W
V
V
A
A
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
V
(BR)DSS
−60 V
CASE 369D
IPAK/DPAK
STYLE 2
1 2
CASE 369C
1
STYLE 2
2
DPAK
20P06L
A
Y
WW
G
ORDERING INFORMATION
3
3
G
http://onsemi.com
130 mW @ −5.0 V
4
4
R
DS(on)
P−Channel
Device Code
= Assembly Location
= Year
= Work Week
= Pb−Free Package
D
MARKING DIAGRAMS
Publication Order Number:
TYP
S
Gate
Gate
1
1
Drain
Drain
Drain
Drain
4
2
4
2
NTD20P06L/D
(Note 1)
I
−15.5 A
D
3
Source
3
Source
MAX

Related parts for NTD20P06LG

NTD20P06LG Summary of contents

Page 1

NTD20P06L Power MOSFET −60 V, −15.5 A, Single P−Channel, DPAK Features • Withstands High Energy in Avalanche and Commutation Modes • Low Gate Charge for Fast Switching • These are Pb−Free Devices Applications • Bridge Circuits • Power Supplies, Power ...

Page 2

ELECTRICAL CHARACTERISTICS (T Parameter OFF CHARACTERISTICS Drain−to−Source Breakdown Voltage Drain−to−Source Breakdown Voltage Temperature Coefficient Zero Gate Voltage Drain Current Gate−to−Source Leakage Current ON CHARACTERISTICS (Note 3) Gate Threshold Voltage Gate Threshold Temperature Coefficient Drain−to−Source On Resistance Forward Transconductance Drain−to−Source On−Voltage ...

Page 3

TYPICAL PERFORMANCE CURVES − − − − −V ...

Page 4

I 6.25 5.0 3.75 2.5 1. Figure 8. Gate−to−Source and Drain−to−Source Voltage versus Total Charge 1000 V = − ...

Page 5

V = − Single Pulse T = 25°C C 100 Limit DS(on) Thermal Limit Package Limit 0.1 0.1 1 −V , DRAIN−TO−SOURCE VOLTAGE (V) DS Figure 11. Maximum Rated Forward Biased Safe Operating Area ...

Page 6

... ORDERING INFORMATION Device NTD20P06L−1G NTD20P06LG NTD20P06LT4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package DPAK (Pb−Free) http://onsemi.com 6 † Shipping 75 Units / Rail 75 Units / Rail 2500 / Tape & Reel ...

Page 7

... DETAIL 0.005 (0.13 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS DPAK (SINGLE GAUGE) CASE 369C−01 ISSUE GAUGE SEATING L2 C PLANE PLANE DETAIL A ROTATED SOLDERING FOOTPRINT* 6 ...

Page 8

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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