IRF630S Vishay, IRF630S Datasheet - Page 2

• Manufacturer Part Number: IRF630S
• Description: MOSFET N-CH 200V 9A D2PAK
• Manufacturer: Vishay

Specifications of IRF630S

• Fet Type: MOSFET N-Channel, Metal Oxide
• Fet Feature: Standard
• Rds On (max) @ Id, Vgs: 400 mOhm @ 5.4A, 10V
• Drain To Source Voltage (vdss): 200V
• Current - Continuous Drain (id) @ 25° C: 9A
• Vgs(th) (max) @ Id: 4V @ 250µA
• Gate Charge (qg) @ Vgs: 43nC @ 10V
• Input Capacitance (ciss) @ Vds: 800pF @ 25V
• Power - Max: 3W
• Mounting Type: Surface Mount
• Package / Case: D²Pak, TO-263 (2 leads + tab)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Source-Drain Ratings and Characteristics
Thermal Resistance
IRF630N/S/L
Electrical Characteristics @ T
www.irf.com
R
R
R
R
V
∆V
R
V
g
I
I
Q
Q
Q
t
t
t
t
C
C
C
I
I
V
t
Q
t
L
L
DSS
GSS
S
SM
rr
on
d(on)
r
d(off)
f
fs
D
S
θJC
θCS
θJA
θJA
SD
(BR)DSS
GS(th)
DS(on)
g
gs
gd
iss
oss
rss
rr
(BR)DSS
/∆T
J
Drain-to-Source Leakage Current
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
Forward Turn-On Time
Drain-to-Source Breakdown Voltage
Breakdown Voltage Temp. Coefficient
Static Drain-to-Source On-Resistance
Gate Threshold Voltage
Forward Transconductance
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Internal Drain Inductance
Internal Source Inductance
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Junction-to-Ambient (PCB mount)

Parameter
Parameter
Parameter
„
J
= 25°C (unless otherwise specified)
…
200
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
Min. Typ. Max. Units
Min. Typ. Max. Units
2.0
4.9
–––
–––
–––
–––
–––
–––
„
Intrinsic turn-on time is negligible (turn-on is dominated by L
0.26
–––
––– 0.30
–––
–––
–––
–––
–––
––– -100
–––
–––
–––
575
–––
–––
–––
117
542
7.9
4.5
7.5
14
27
15
89
25
–––
–––
–––
–––
250
100
–––
–––
–––
–––
–––
–––
–––
–––
176
813
4.0
6.5
1.3
9.3
25
35
17
37
V/°C
µA
nA
nC
ns
nC
pF
nH
ns
Ω
V
V
V
S
Typ.
0.50
–––
–––
–––
V
Reference to 25°C, I
V
V
V
V
V
V
V
I
V
V
V
I
R
R
Between lead,
6mm (0.25in.)
from package
and center of die contact
V
V
ƒ = 1.0MHz
MOSFET symbol
showing the
integral reverse
p-n junction diode.
T
T
di/dt = 100A/µs
D
D
J
J
GS
GS
DS
DS
DS
DS
GS
GS
DS
GS
DD
GS
DS
G
D
= 5.4A
= 5.4A
= 25°C, I
= 25°C, I
= 18Ω
= 13Ω
= 0V, I
= 10V, I
= V
= 50V, I
= 200V, V
= 160V, V
= 20V
= -20V
= 160V
= 10V
= 100V
= 0V
= 25V
GS
, I
D
ƒ
S
F
ƒ
D
D
D
Conditions
= 250µA
Conditions
= 5.4A, V
= 5.4A
= 5.4A
= 250µA
= 5.4A ƒ
GS
GS
Max.
ƒ
1.83
–––
62
40
= 0V
= 0V, T
D
= 1mA
GS
ƒ
J
G
= 0V
= 150°C
G
Units
S
°C/W
+L
ƒ
D
D
S
)
S
D
2