IRF3315S International Rectifier, IRF3315S Datasheet

MOSFET N-CH 150V 21A D2PAK

IRF3315S

Manufacturer Part Number
IRF3315S
Description
MOSFET N-CH 150V 21A D2PAK
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF3315S

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
82 mOhm @ 12A, 10V
Drain To Source Voltage (vdss)
150V
Current - Continuous Drain (id) @ 25° C
21A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
95nC @ 10V
Input Capacitance (ciss) @ Vds
1300pF @ 25V
Power - Max
3.8W
Mounting Type
Surface Mount
Package / Case
D²Pak, TO-263 (2 leads + tab)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF3315S

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF3315S
Manufacturer:
IR
Quantity:
10 000
Part Number:
IRF3315S
Manufacturer:
IR
Quantity:
704
Company:
Part Number:
IRF3315STRLPBF
Quantity:
15 872
Part Number:
IRF3315STRRPBF
Manufacturer:
TI
Quantity:
3 432
Absolute Maximum Ratings
Thermal Resistance
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power MOSFETs
are well known for, provides the designer with an extremely
efficient and reliable device for use in a wide variety of
applications.
The D
accommodating die sizes up to HEX-4. It provides the
highest power capability and the lowest possible on-
resistance in any existing surface mount package. The
D
its low internal connection resistance and can dissipate
up to 2.0W in a typical surface mount application.
The through-hole version (IRF3315L) is available for low-
profile applications.
R
R
I
I
I
P
P
V
E
I
E
dv/dt
T
T
AR
D
D
DM
2
AS
AR
J
STG
D
D
GS
Pak is suitable for high current applications because of
JA
@ T
@ T
JC
@T
@T
Advanced Process Technology
Surface Mount (IRF3315S)
Low-profile through-hole (IRF3315L)
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
2
C
C
Pak is a surface mount power package capable of
A
C
= 25°C
= 25°C
= 100°C
= 25°C
on-resistance per silicon area.
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Parameter
Parameter
PRELIMINARY
GS
GS
@ 10V
@ 10V
This
G
Typ.
300 (1.6mm from case )
–––
–––
HEXFET
D P ak
2
-55 to + 175
S
D
IRF3315S/L
Max.
0.63
± 20
350
3.8
9.4
2.5
21
15
84
94
12
®
R
Power MOSFET
DS(on)
V
T O -26 2
Max.
1.6
DSS
40
I
D
= 21A
PD - 9.1617A
= 0.082
= 150V
Units
Units
W/°C
V/ns
°C/W
mJ
mJ
W
W
°C
A
V
A
11/7/97

Related parts for IRF3315S

IRF3315S Summary of contents

Page 1

... Advanced Process Technology Surface Mount (IRF3315S) Low-profile through-hole (IRF3315L) 175°C Operating Temperature Fast Switching Fully Avalanche Rated Description Fifth Generation HEXFETs from International Rectifier utilize advanced processing techniques to achieve extremely low on-resistance per silicon area. benefit, combined with the fast switching speed and ...

Page 2

... IRF3315S/L Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge g Q Gate-to-Source Charge ...

Page 3

... V 20µs PULSE WIDTH Gate-to-Source Voltage (V) GS Fig 3. Typical Transfer Characteristics ° 100 ° 175 50V IRF3315S/L 100 VGS TOP 15V 10V 8.0V 7.0V 6.0V 5.5V 5.0V BOTTOM 4.5V 10 20µs PULSE WIDTH T = 175 0 Drain-to-Source Voltage (V) DS Fig 2. Typical Output Characteristics 3 ...

Page 4

... IRF3315S/L 3000 iss rss gd 2500 oss ds C iss 2000 1500 C oss 1000 C rss 500 Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 100 10 ° 175 0.1 0.2 0.5 0.8 V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode Forward Voltage f = 1MHz C SHORTED ...

Page 5

... RESPONSE) 0.01 0.00001 0.0001 Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case Fig 10a. Switching Time Test Circuit 125 150 175 ° Fig 10b. Switching Time Waveforms 0.001 t , Rectangular Pulse Duration (sec) 1 IRF3315S D.U. 10V Pulse Width µs Duty Factor V DS ...

Page 6

... IRF3315S 20V Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 1000 15 V 800 600 + - 400 200 TOP BOTTOM 100 125 Starting T , Junction Temperature ( C) J Fig 12c. Maximum Avalanche Energy Vs. Drain Current Current Regulator Same Type as D ...

Page 7

... Fig 14. For N-Channel HEXFETS Circuit Layout Considerations Low Stray Inductance Ground Plane Low Leakage Inductance Current Transformer - + dv/dt controlled Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test P. Period Current di/dt Diode Recovery dv/dt Forward Drop 5% IRF3315S =10V ...

Page 8

... IRF3315S Pak Package Outline 10.54 (.415) 10.29 (.405) 1.40 (.055 1.78 (.070) 1.27 (.050 1.40 (.055) 3X 1.14 (.045) 5.08 (.200 ) & 14.5M , 1982 LLIN & Part Marking Information 2 D Pak TIF 4.69 (.185) 4.20 (.165) 15.49 (.610) 14.73 (.580) 5.28 (.208) 4 ...

Page 9

... Package Outline TO-262 Outline Part Marking Information TO-262 IRF3315S/L ...

Page 10

... IRF3315S/L Tape & Reel Information 2 D Pak TIO 330.00 (14.173 - LIN ILL WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR FAR EAST: K& ...

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