IRFP250 STMicroelectronics, IRFP250 Datasheet

MOSFET N-CH 200V 33A TO-247

IRFP250

Manufacturer Part Number
IRFP250
Description
MOSFET N-CH 200V 33A TO-247
Manufacturer
STMicroelectronics
Series
PowerMESH™r
Datasheet

Specifications of IRFP250

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
85 mOhm @ 16A, 10V
Drain To Source Voltage (vdss)
200V
Current - Continuous Drain (id) @ 25° C
33A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
158nc @ 10V
Input Capacitance (ciss) @ Vds
2850pF @ 25V
Power - Max
180W
Mounting Type
Through Hole
Package / Case
TO-247-3
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
497-2639-5

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DESCRIPTION
The PowerMESH
generation of MESH OVERLAY
finements introduced greatly improve the Ron*area
figure of merit while keeping the device at the lead-
ing edge for what concerns swithing speed, gate
charge and ruggedness.
APPLICATIONS
ABSOLUTE MAXIMUM RATINGS
(•)Pulse width limited by safe operating area
Sep 2000
IRFP250
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
NEW HIGH VOLTAGE BENCHMARK
GATE CHARGE MINIMIZED
HIGH CURRENT, HIGH SPEED SWITCHING
UNINTERRUPTIBLE POWER SUPPLIES (UPS)
DC-AC CONVERTERS FOR TELECOM,
INDUSTRIAL, AND LIGHTING EQUIPMENT
Symbol
dv/dt(1)
I
V
DM
P
V
V
T
DGR
I
I
TOT
T
GS
stg
DS
D
D
TYPE
j
( )
Drain-source Voltage (V
Drain-gate Voltage (R
Gate- source Voltage
Drain Current (continuos) at T
Drain Current (continuos) at T
Drain Current (pulsed)
Total Dissipation at T
Derating Factor
Peak Diode Recovery voltage slope
Storage Temperature
Max. Operating Junction Temperature
DS
(on) = 0.073
200V
V
II is the evolution of the first
DSS
< 0.085
R
DS(on)
C
™.
GS
Parameter
= 25°C
GS
N-CHANNEL 200V - 0.073 - 33A TO-247
= 20 k )
The layout re-
= 0)
C
C
= 25°C
= 100°C
33 A
I
D
(1)I
SD
INTERNAL SCHEMATIC DIAGRAM
33A, di/dt 300A/µs, V
PowerMesh™II MOSFET
–65 to 150
TO-247
DD
Value
1.44
200
200
±20
132
180
150
33
20
5
V
(BR)DSS
1
IRFP250
, T
2
j
3
T
JMAX.
W/°C
Unit
V/ns
°C
°C
W
V
V
V
A
A
A
1/8

Related parts for IRFP250

IRFP250 Summary of contents

Page 1

... Sep 2000 N-CHANNEL 200V - 0.073 - 33A TO-247 R I DS(on ™. The layout re- INTERNAL SCHEMATIC DIAGRAM Parameter = 25° 100° 25°C C (1)I 33A, di/dt 300A/µ IRFP250 PowerMesh™II MOSFET TO-247 Value 200 200 ± 132 180 1.44 5 –65 to 150 150 (BR)DSS j JMAX ...

Page 2

... IRFP250 THERMAL DATA Rthj-case Thermal Resistance Junction-case Max Rthj-amb Thermal Resistance Junction-ambient Max Rthc-sink Thermal Resistance Case-sink Typ T Maximum Lead Temperature For Soldering Purpose l AVALANCHE CHARACTERISTICS Symbol Avalanche Current, Repetitive or Not-Repetitive I AR (pulse width limited by T Single Pulse Avalanche Energy E AS (starting ° ...

Page 3

... GS G Test Conditions V = 160V 4 10V G GS (see test circuit, Figure 5) Test Conditions Min di/dt = 100A/µ 100V 150° (see test circuit, Figure 5) Thermal Impedance IRFP250 Typ. Max. Unit 117 158 Min. Typ. Max. Unit 100 ns Typ. Max. Unit 33 A 132 A 1 ...

Page 4

... IRFP250 Output Characteristics Tranconductance Gate Charge vs Gate-source Voltage 4/8 Tranfer Characteristics Static Drain-Source On Resistance Capacitance Variations ...

Page 5

... Normalized Gate Thereshold Voltage vs Temp. Source-drain Diode Forward Characteristics Normalized On Resistance vs Temperature IRFP250 5/8 ...

Page 6

... IRFP250 Fig. 1: Unclamped Inductive Load Test Circuit Fig. 3: Switching Times Test Circuit For Resistive Load Fig. 5: Test Circuit For Inductive Load Switching And Diode Recovery Times 6/8 Fig. 2: Unclamped Inductive Waveform Fig. 4: Gate Charge test Circuit ...

Page 7

... M 2 inch MAX. MIN. TYP. 5.3 0.185 2.6 0.087 0.8 0.016 1.4 0.039 2.4 0.079 3.4 0.118 0.429 15.9 0.602 20.3 0.776 14.8 0.559 1.362 0.217 3 0.079 IRFP250 MAX. 0.209 0.102 0.031 0.055 0.094 0.134 0.626 0.779 0.582 0.118 P025P 7/8 ...

Page 8

... IRFP250 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice ...

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