IRF6621 International Rectifier, IRF6621 Datasheet - Page 3

MOSFET N-CH 30V 12A DIRECTFET

IRF6621

Manufacturer Part Number
IRF6621
Description
MOSFET N-CH 30V 12A DIRECTFET
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF6621

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
9.1 mOhm @ 12A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
12A
Vgs(th) (max) @ Id
2.25V @ 250µA
Gate Charge (qg) @ Vgs
17.5nC @ 4.5V
Input Capacitance (ciss) @ Vds
1460pF @ 15V
Power - Max
2.2W
Mounting Type
Surface Mount
Package / Case
DirectFET™ Isometric SQ
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF6621PBF-6
Manufacturer:
IR
Quantity:
4 775
Part Number:
IRF6621TRPBF
Manufacturer:
IR
Quantity:
20 000

ƒ
air).
Notes:
P
P
P
T
T
T
R
R
R
R
R
Absolute Maximum Ratings
Thermal Resistance
 Surface mounted on 1 in. square Cu (still
www.irf.com
P
J
STG
D
D
D
θJA
θJA
θJA
θJC
θJ-PCB
back and with small clip heatsink.
Surface mounted on 1 in. square Cu board, steady state.
Used double sided cooling , mounting pad.
Mounted on minimum footprint full size board with metalized
See AN-994 for additional details.
@T
@T
@T
A
A
C
= 25°C
= 70°C
= 25°C
0.01
100
0.1
10
Fig 3. Maximum Effective Transient Thermal Impedance, Junction-to-Ambient
1
1E-006
D = 0.50
Power Dissipation
Power Dissipation
Power Dissipation
Peak Soldering Temperature
Operating Junction and
Storage Temperature Range
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Ambient
Junction-to-Case
Junction-to-PCB Mounted
Linear Derating Factor
0.05
0.02
0.01
0.10
0.20
1E-005
SINGLE PULSE
( THERMAL RESPONSE )
fg
0.0001
f
dg
eg
g
Parameter
Parameter
Ã
t 1 , Rectangular Pulse Duration (sec)
0.001
ƒ
small clip heatsink (still air)
τ
J
τ
J
τ
1
Ci= τi/Ri
τ
1
Ci= τi/Ri
T
R
0.01
C
θ
R
is measured at
1
measured with thermocouple incontact with top (Drain) of part.
R
1
τ
2
τ
R
2
2
R
2
with
R
τ
0.1
3
3
R
τ
3
3
J
τ
Typ.
12.5
R
4
–––
–––
1.0
τ
20
4
R
4
4
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthja + Tc
R
τ
-40 to + 150
5
5
R
τ
5
5
1
Max.
0.017
τ
footprint full size board with
metalized back and with small
clip heatsink (still air)
C
ƒ Mounted on minimum
270
2.2
1.4
42
τ
Ri (°C/W)
1.6195
2.1406
22.2887
20.0457
11.9144
Max.

–––
–––
–––
3.0
58
10
0.000126
0.001354
0.375850
7.410000
99
τi (sec)
100
Units
Units
°C/W
W/°C
°C
W
3

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