VN2222LLRLRA ON Semiconductor, VN2222LLRLRA Datasheet

MOSFET N-CH 60V 150MA TO-92

VN2222LLRLRA

Manufacturer Part Number
VN2222LLRLRA
Description
MOSFET N-CH 60V 150MA TO-92
Manufacturer
ON Semiconductor
Datasheet

Specifications of VN2222LLRLRA

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
7.5 Ohm @ 500mA, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
150mA
Vgs(th) (max) @ Id
2.5V @ 1mA
Input Capacitance (ciss) @ Vds
60pF @ 25V
Power - Max
400mW
Mounting Type
Through Hole
Package / Case
TO-92-3 (Standard Body), TO-226
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Gate Charge (qg) @ Vgs
-
VN2222LL
Small Signal MOSFET
150 mAmps, 60 Volts
N−Channel TO−92
Features
*For additional information on our Pb−Free strategy and soldering details, please
September, 2004 − Rev. 3
MAXIMUM RATINGS
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
THERMAL CHARACTERISTICS
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
Drain −Source Voltage
Drain−Gate Voltage (R
Gate−Source Voltage
Drain Current
Total Power Dissipation @ T
Operating and Storage Temperature Range
Thermal Resistance, Junction−to−Ambient
Maximum Lead Temperature for
Pb−Free Packages are Available*
Semiconductor Components Industries, LLC, 2004
− Continuous
− Non−repetitive (t
− Continuous
− Pulsed
Derate above 25 C
Soldering Purposes, 1/16 from case
for 10 seconds
Characteristic
Rating
p
GS
50 ms)
= 1.0 MW)
A
Preferred Device
= 25 C
Symbol
Symbol
T
V
V
V
R
J
V
I
GSM
P
DGR
, T
T
DSS
DM
I
qJA
GS
D
D
L
stg
−55 to
Value
312.5
+150
1000
Max
150
400
300
3.2
60
60
20
40
1
mW/ C
mAdc
Unit
Unit
Vdc
Vdc
Vdc
Vpk
mW
C/W
C
C
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
1 2
3
ORDERING INFORMATION
A
Y
WW
Source
MARKING DIAGRAM
& PIN ASSIGNMENT
R
G
http://onsemi.com
150 mA, 60 V
DS(on)
1
= Assembly Location
= Year
= Work Week
AYWW
VN22
N−Channel
22LL
Gate
2
Publication Order Number:
D
= 7.5 W
STYLE 22
CASE 29
TO−92
S
3
Drain
VN2222LL/D

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VN2222LLRLRA Summary of contents

Page 1

... Maximum Lead Temperature for Soldering Purposes, 1/16 from case for 10 seconds *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2004 September, 2004 − Rev. 3 Symbol ...

Page 2

... Pulse Test: Pulse Width v 300 ms, Duty Cycle v 2.0%. ORDERING INFORMATION Device VN2222LL VN2222LLG VN2222LLRL VN2222LLRLRA VN2222LLRLRAG VN2222LLRLRM †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. VN2222LL ( unless otherwise noted) ...

Page 3

1.8 A 1.6 1.4 1.2 1 0.8 0.6 0.4 0 DRAIN−SOURCE VOLTAGE (VOLTS) DS Figure 1. Ohmic Region 2.4 2 ...

Page 4

... ISSUE SECTION X−X N. American Technical Support: 800−282−9855 Toll Free USA/Canada Japan: ON Semiconductor, Japan Customer Focus Center 2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051 Phone: 81−3−5773−3850 http://onsemi.com 4 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. ...

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