GRM31MR71E224KA01L Murata Electronics, GRM31MR71E224KA01L Datasheet - Page 215
![no-image](/images/manufacturer_photos/0/4/465/murata_electronics_sml.jpg)
GRM31MR71E224KA01L
Manufacturer Part Number
GRM31MR71E224KA01L
Description
Cap Ceramic 0.22uF 25VDC X7R 10% SMD 1206 Embossed T/R
Manufacturer
Murata Electronics
Type
Flatr
Datasheet
1.GNM1M2R61A105ME14D.pdf
(221 pages)
Specifications of GRM31MR71E224KA01L
Package/case
1206
Mounting
Surface Mount
Capacitance Value
0.22 uF
Dielectric
X7R
Voltage
25 Vdc
Product Length
3.2 mm
Product Height
1.15 mm
Product Depth
1.6 mm
Tolerance
10 %
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
GRM31MR71E224KA01L
Manufacturer:
MURATA
Quantity:
42 000
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!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Construction of Board Pattern
Construction and Dimensions of Pattern (Example)
Dimensions of Slit (Example)
214
Notice
Notice (Soldering and Mounting)
After installing chips, if solder is excessively applied to
the circuit board, mechanical stress will cause destruction
resistance characteristics to lower. To prevent this, be
extremely careful in determining shape and dimension
before designing the circuit board diagram.
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Chip Capacitor
Chip Capacitor
Preparing the slit helps flux cleaning and resin
coating on the back of the capacitor.
However, the length of the slit design should
be as short as possible to prevent mechanical
damage in the capacitor.
A longer slit design might receive more severe
mechanical stress from the PCB.
Recommended slit design is shown in the
Table.
c
b
a
d
e
Slit
Solder Resist
Solder Resist
Land
Land
L
L
W
W
Flow Soldering
Flow soldering : 3.2g1.6 or less available.
Reflow Soldering
1.6g0.8
2.0g1.25
3.2g1.6
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
4.5g2.0
4.5g3.2
5.7g2.8
5.7g5.0
1.6g0.8
2.0g1.25
3.2g1.6
3.2g2.5
4.5g2.0
4.5g3.2
5.7g2.8
5.7g5.0
LgW
LgW
LgW
0.6-1.0
1.0-1.2
2.2-2.6
0.6-0.8
1.0-1.2
2.2-2.4
2.0-2.4
2.8-3.4
2.8-3.4
4.0-4.6
4.0-4.6
1.0-2.0
1.0-2.0
1.0-2.8
1.0-2.8
1.0-4.0
1.0-4.0
d
a
a
-
-
0.8-0.9
0.9-1.0
1.0-1.1
0.6-0.7
0.6-0.7
0.8-0.9
1.0-1.2
1.2-1.4
1.2-1.4
1.4-1.6
1.4-1.6
3.2-3.7
4.1-4.6
3.6-4.1
4.8-5.3
4.4-4.9
6.6-7.1
(in mm)
b
b
e
-
-
Continued on the following page.
0.6-0.8
0.8-1.1
1.0-1.4
0.6-0.8
0.8-1.1
1.0-1.4
1.8-2.3
1.4-1.8
2.3-3.0
2.1-2.6
3.5-4.8
(in mm)
c
c
C02E.pdf
10.12.20
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