HSMS-2802-TR1G Avago Technologies US Inc., HSMS-2802-TR1G Datasheet - Page 2

• Manufacturer Part Number: HSMS-2802-TR1G
• Description: DIODE SCHOTTKY RF SER 70V SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-2802-TR1G

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Diode Type: Schottky - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 70V
• Current - Max: 1A
• Capacitance @ Vr, F: 2pF @ 0V, 1MHz
• Resistance @ If, F: 35 Ohm @ 5mA, 1MHz
• Product: Schottky Diodes
• Peak Reverse Voltage: 70 V
• Forward Continuous Current: 1 A
• Max Surge Current: 1 A
• Configuration: Dual Series
• Forward Voltage Drop: 1 V @ 0.015 A
• Maximum Reverse Leakage Current: 0.2 uA @ 50 V
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Capacitance, Junction: 2 pF
• Current, Forward: 15 mA
• Package Type: SOT-23
• Primary Type: Schottky Barrier
• Resistance, Thermal, Junction To Case: 500 °C/W
• Speed, Switching: RF
• Temperature, Junction, Maximum: +150 °C
• Voltage, Forward: 1 V
• Voltage, Reverse: 70 V
• Rectifier Type: Schottky Diode
• Peak Rep Rev Volt: 70V
• Avg. Forward Curr (max): 1A
• Rev Curr: 0.2uA
• Forward Voltage: 1V
• Operating Temp Range: -65C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Capacitance Ct: 2pF
• Diode Case Style: SOT-23
• Breakdown Voltage: 70V
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Forward Current If Max: 1A
• Forward Voltage Vf Max: 410mV
• No. Of Pins: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1810-2; HSMS-2802-TR1G

Absolute Maximum Ratings
Notes:
1. Operation in excess of any one of these conditions may result in permanent damage to the device.
2. T
Electrical Specifications T
Notes:
1. DV
2. DC
3. Effective Carrier Lifetime (t) for all these diodes is 100 ps maximum measured with Krakauer method at 5 mA.
4. See section titled “Quad Capacitance. ”
5. R
2
Pin Connections and Package Marking, SOT-363
1
2
3
Symbol
I
P
T
T
T
Part
Number
HSMS
2800
2802
2803
2804
2805
2808
280B
280C
280E
280F
280K
280L
280M
280N
280P
280R
Test Conditions
f
j
stg
IV
jc
D
C
F
TO
= R
[4]
= +25°C, where T
for diodes in pairs and quads in 15 mV maximum at 1 mA.
for diodes in pairs and quads is 0.2 pF maximum.
S
+ 5.2 Ω at 25°C and I
Package
Marking
Code
A0
A2
A3
A4
A5
A8
A0
A2
A3
A4
AK
AL
AP
H
N
O
Parameter
Forward Current (1 μs Pulse)
Peak Inverse Voltage
Junction Temperature
Storage Temperature
Thermal Resistance
C
Lead
Code
is defined to be the temperature at the package pins where contact is made to the circuit board.
M
C
N
0
2
3
4
5
8
B
E
F
K
L
P
R
6
5
4
f
= 5 mA.
A
[1]
Configuration
Single
Series
Common Anode
Common Cathode
Unconnected Pair
Bridge Quad
Single
Series
Common Anode
Common Cathode
High Isolation
Unconnected Pair
Unconnected Trio
Common Cathode Quad
Common Anode Quad
Bridge Quad
Ring Quad
= 25°C, Single Diode
Notes:
1. Package marking provides orientation and identification.
2. See “Electrical Specifications” for appropriate package marking.
ESD WARNING:
Handling Precautions Should Be Taken To Avoid Static Discharge.
T
C
[2]
= 25°C
[4]
[3]
I
Breakdown
R
Minimum
Voltage
= 10 mA
V
BR
70
(V)
Unit
Amp
V
°C
°C
°C/W
I
Maximum
F
Forward
Voltage
V
= 1 mA
F
410
(mV)
V
SOT-23/SOT-143
1
Same as V
150
-65 to 150
500
F
Maximum
(V) @ I
1.0 @ 15
Forward
Voltage
F
(mA)
BR
I
R
200 @ 50
(nA) @ V
Maximum
Leakage
Reverse
R
(V)
SOT-323/SOT-363
1
Same as V
150
-65 to 150
150
Capacitance
f = 1 MHz
Maximum
V
C
F
T
2.0
= 0 V
(pF)
BR
Resistance
I
F
Dynamic
R
Typical
= 5 mA
D
35
(Ω)
[5]