HSMP-3822-BLKG Avago Technologies US Inc., HSMP-3822-BLKG Datasheet - Page 6

• Manufacturer Part Number: HSMP-3822-BLKG
• Description: DIODE PIN SWITCH 50V SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMP-3822-BLKG

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 50V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.8pF @ 20V, 1MHz
• Resistance @ If, F: 600 mOhm @ 10mA, 100MHz
• Configuration: Dual Series
• Reverse Voltage: 50 V
• Forward Continuous Current: 1 A
• Frequency Range: UHF
• Termination Style: SMD/SMT
• Carrier Life: 0.07 us
• Maximum Diode Capacitance: 0.8 pF @ 20 V
• Maximum Operating Temperature: + 150 C
• Maximum Series Resistance @ Maximum If: 0.6 Ohm @ 10 mA
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Recovery Time: 7 nS
• Diode Case Style: SOT-23
• Breakdown Voltage: 50V
• Capacitance Ct: 0.8pF
• Leaded Process Compatible: Yes
• Peak Reflow Compatible (260 C): Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 516-1905; HSMP-3822-BLKG

Assembly Information
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT-
323 (SC-70) package is shown in Figure 19 (dimensions
are in inches). This layout provides ample allowance for
package placement by automated assembly equipment
without adding parasitics that could impair the
performance.
Figure 19. Recommended PCB Pad Layout
for Avago’s SC70 3L/SOT-323 Products.
SOT-23 PCB Footprint
0.039
Figure 20. Recommended PCB Pad Layout
for Avago’s SOT-23 Products.
6
0.039
0.035
1
0.9
0.026
Dimensions in inches
0.022
Dimensions in inches
0.079
0.031
0.8
0.039
mm
1
0.079
2.0