HSMP-3892-BLKG Avago Technologies US Inc., HSMP-3892-BLKG Datasheet - Page 9
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HSMP-3892-BLKG
Manufacturer Part Number
HSMP-3892-BLKG
Description
DIODE PIN SWITCH 100V SOT-23
Manufacturer
Avago Technologies US Inc.
Datasheet
1.HSMP-3890-BLKG.pdf
(13 pages)
Specifications of HSMP-3892-BLKG
Diode Type
PIN - 1 Pair Series Connection
Voltage - Peak Reverse (max)
100V
Current - Max
1A
Capacitance @ Vr, F
0.3pF @ 5V, 1MHz
Resistance @ If, F
2.5 Ohm @ 5mA, 100MHz
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Diode Case Style
SOT-23
No. Of Pins
3
Capacitance Ct
0.2pF
Termination Type
SMD
Mounting Type
Surface Mount
Breakdown Voltage
100V
Packaging Type
Cut Tape
Filter Terminals
SMD
Rohs Compliant
Yes
Capacitance
0.30pF
Current Rating
1A
Leaded Process Compatible
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-1908
HSMP-3892-BLKG
HSMP-3892-BLKG
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HSMP-3892-BLKG
Manufacturer:
AVAGO
Quantity:
40 000
SMT Assembly
Reliable assembly of surface mount components is a
complex process that involves many material, process,
and equipment factors, including: method of heating
(e.g., IR or vapor phase reflow, wave soldering, etc.) cir-
cuit board material, conductor thickness and pattern,
type of solder alloy, and the thermal conductivity and
thermal mass of components. Components with a low
mass, such as the SOT package, will reach solder reflow
temperatures faster than those with a greater mass.
Avago Technologies’ diodes have been qualified to the
time-temperature profile shown in Figure 26. This profile
is representative of an IR reflow type of surface mount
assembly process.
After ramping up from room temperature, the circuit
board with components attached to it (held in place
with solder paste) passes through one or more preheat
Figure 26. Surface Mount Assembly Profile.
Lead-Free Reflow Profile Recommendation (IPC/JEDEC J-STD-020C)
Note 1: All temperatures refer to topside of the package, measured on the package body surface
9
Reflow Parameter
Average ramp-up rate (Liquidus Temperature (T
Preheat
Ts(max) to TL Ramp-up Rate
Time maintained above:
Peak Temperature (T
Time within 5 °C of actual Peak temperature (t
Ramp-down Rate
Time 25 °C to Peak Temperature
Tp
T
25
L
Ts
Ts
min
max
P
)
t 25
Preheat
°
ts
C to Peak
Temperature Min (T
Temperature Max (T
Time (min to max) (t
Temperature (T
Time (t
P
L
)
)
Ramp-up
S(max)
Time
to Peak)
L
)
S(min)
S(max)
S
)
Ramp-down
tp
)
)
zones. The preheat zones increase the temperature of
the board and components to prevent thermal shock
and begin evaporating solvents from the solder paste.
The reflow zone briefly elevates the temperature suffi-
ciently to produce a reflow of the solder.
The rates of change of temperature for the ramp-up and
cool-down zones are chosen to be low enough to not
cause deformation of the board or damage to compo-
nents due to thermal shock. The maximum temperature
in the reflow zone (T
These parameters are typical for a surface mount assem-
bly process for Avago Technologies diodes. As a general
guideline, the circuit board and components should be
exposed only to the minimum temperatures and times
necessary to achieve a uniform reflow of solder.
t
L
Lead-Free Assembly
3°C/ second max
150°C
200°C
60-180 seconds
3°C/second max
217°C
60-150 seconds
260 +0/-5°C
20-40 seconds
6°C/second max
8 minutes max
Critical Zone
T
L
to Tp
MAX
) should not exceed 260°C.