GRM31MF51C106ZA12L Murata Electronics, GRM31MF51C106ZA12L Datasheet

GRM31MF51C106ZA12L

Manufacturer Part Number

GRM31MF51C106ZA12L

Description

CAP 10UF 16VDC Y5V -20% TO 80% SMD 1206

Manufacturer

Murata Electronics

Type

Flatr

Datasheet

1.GRM31MF51C106ZA12L.pdf (1 pages)

Specifications of GRM31MF51C106ZA12L

Package/case

1206

Mounting

Surface Mount

Capacitance Value

10 uF

Dielectric

Y5V

Voltage

16 Vdc

Product Length

3.2 mm

Product Height

1.15 mm

Product Depth

1.6 mm

Tolerance

-20 to 80 %

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

GRM31MF51C106ZA12L

Manufacturer:

MURATA

Quantity:

400 000

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I Dimensions

I Rated Value

! Note:

1. This datasheet is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our

2. This datasheet has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product

• The RoHS compliance means that we judge from EU Directive 2002/95/EC the products do not contain lead, cadmium, mercury, hexavalent

• This statement does not insure the compliance of any of the listed parts with any laws or legal imperatives developed by any EU members

Temperature Char.

products in it may be discontinued without advance notice. Please check with our sales representatives or product engineers before ordering.

specifications or transact the approval sheet for product specifications before ordering.

Capacitance Tol.

chromium, PBB and PBDE, except exemptions stated in EU Directive 2002/95/EC annex and impurities existing in natural world.

individually with regards to the RoHS Directive.

This data sheet is applied for CHIP MONOLITHIC CERAMIC CAPACITOR used for General Electronics equipment for your design.

Use of Sn-Zn based solder will deteriorate reliability of MLCC. Please check with our sales represetatives for the use of Sn-Zn based solder in advance.

Solderability of Tin plating termination chip might be deteriorated when low temperature soldering profile where peak solder temperature is below the Tin

melting point is used. Please confirm the solderability of Tin plating termination chip before use.

Rated Voltage

Capacitance

Electrode Gap g (min.)

Thickness T

Electrode e

Length L

Width W

GRM31MF51C106ZA12p

Monolithic Ceramic Capacitors

Murata PN Code

106