MMBD352LT1G ON Semiconductor, MMBD352LT1G Datasheet - Page 3

• Manufacturer Part Number: MMBD352LT1G
• Description: DIODE SWITCH DUAL 7V SOT23
• Manufacturer: ON Semiconductor

Specifications of MMBD352LT1G

• Diode Type: Schottky - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 7V
• Capacitance @ Vr, F: 1pF @ 0V, 1MHz
• Power Dissipation (max): 225mW
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Product: Ultra Fast Recovery Rectifier
• Configuration: Dual Series
• Reverse Voltage: 7 V
• Forward Voltage Drop: 0.6 V @ 0.01 A
• Reverse Current Ir: 10 uA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Capacitance, Junction: 1 pF
• Current, Forward: 10 mA
• Package Type: SOT-23 (TO-236)
• Power Dissipation: 225 mW
• Primary Type: Schottky Barrier
• Temperature, Junction, Maximum: +150 °C
• Temperature, Operating: -55 to +150 °C
• Voltage, Forward: 0.6 V
• Voltage, Reverse: 7 V
• Rectifier Type: Switching Diode
• Peak Rep Rev Volt: 7V
• Rev Curr: 10uA
• Forward Voltage: 0.6V
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Max: -
• Resistance @ If, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MMBD352LT1GOS; MMBD352LT1GOS; MMBD352LT1GOSTR

STYLE 11:
STYLE 19:
STYLE 9:
STYLE 12:
MMBD352LT1
MMBD353LT1
MMBD354LT1
MMBD355LT1
A
A1
PIN 1. ANODE
PIN 1. CATHODE
PIN 1. ANODE
PIN 1. CATHODE
E
2. CATHODE
3. CATHODE−ANODE
2. ANODE
3. CATHODE−ANODE
2. ANODE
3. CATHODE
2. CATHODE
3. ANODE
1
3
D
e
2
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
VIEW C
PACKAGE DIMENSIONS
0.8
SOLDERING FOOTPRINT*
L1
L
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
q
0.25
c
3
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. 318−01 THRU −07 AND −09 OBSOLETE,
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
NEW STANDARD 318−08.
0.079
DIM
A1
H
2.0
L1
A
b
D
E
c
e
L
E
inches
mm
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX