MMBD352LT1G ON Semiconductor, MMBD352LT1G Datasheet - Page 3

DIODE SWITCH DUAL 7V SOT23

MMBD352LT1G

Manufacturer Part Number
MMBD352LT1G
Description
DIODE SWITCH DUAL 7V SOT23
Manufacturer
ON Semiconductor
Datasheets

Specifications of MMBD352LT1G

Diode Type
Schottky - 1 Pair Series Connection
Voltage - Peak Reverse (max)
7V
Capacitance @ Vr, F
1pF @ 0V, 1MHz
Power Dissipation (max)
225mW
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Product
Ultra Fast Recovery Rectifier
Configuration
Dual Series
Reverse Voltage
7 V
Forward Voltage Drop
0.6 V @ 0.01 A
Reverse Current Ir
10 uA
Mounting Style
SMD/SMT
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 55 C
Capacitance, Junction
1 pF
Current, Forward
10 mA
Package Type
SOT-23 (TO-236)
Power Dissipation
225 mW
Primary Type
Schottky Barrier
Temperature, Junction, Maximum
+150 °C
Temperature, Operating
-55 to +150 °C
Voltage, Forward
0.6 V
Voltage, Reverse
7 V
Rectifier Type
Switching Diode
Peak Rep Rev Volt
7V
Rev Curr
10uA
Forward Voltage
0.6V
Operating Temp Range
-55C to 150C
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Current - Max
-
Resistance @ If, F
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
MMBD352LT1GOS
MMBD352LT1GOS
MMBD352LT1GOSTR

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MMBD352LT1G
Manufacturer:
ON
Quantity:
1 673
Part Number:
MMBD352LT1G
Manufacturer:
ON Semiconductor
Quantity:
9 813
Part Number:
MMBD352LT1G
Manufacturer:
ON Semiconductor
Quantity:
1 650
Part Number:
MMBD352LT1G
Manufacturer:
ON/安森美
Quantity:
20 000
STYLE 11:
STYLE 19:
STYLE 9:
STYLE 12:
MMBD352LT1
MMBD353LT1
MMBD354LT1
MMBD355LT1
A
A1
PIN 1. ANODE
PIN 1. CATHODE
PIN 1. ANODE
PIN 1. CATHODE
E
2. CATHODE
3. CATHODE−ANODE
2. ANODE
3. CATHODE−ANODE
2. ANODE
3. CATHODE
2. CATHODE
3. ANODE
1
3
D
e
2
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
VIEW C
PACKAGE DIMENSIONS
0.8
SOLDERING FOOTPRINT*
L1
L
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
q
0.25
c
3
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
4. 318−01 THRU −07 AND −09 OBSOLETE,
ANSI Y14.5M, 1982.
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
NEW STANDARD 318−08.
0.079
DIM
A1
H
2.0
L1
A
b
D
E
c
e
L
E
inches
mm
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
MAX
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
1.11
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX

Related parts for MMBD352LT1G