MMBD352LT1G ON Semiconductor, MMBD352LT1G Datasheet - Page 3

• Manufacturer Part Number: MMBD352LT1G
• Description: DIODE SWITCH DUAL 7V SOT23
• Manufacturer: ON Semiconductor

Specifications of MMBD352LT1G

• Diode Type: Schottky - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 7V
• Capacitance @ Vr, F: 1pF @ 0V, 1MHz
• Power Dissipation (max): 225mW
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Product: Ultra Fast Recovery Rectifier
• Configuration: Dual Series
• Reverse Voltage: 7 V
• Forward Voltage Drop: 0.6 V @ 0.01 A
• Reverse Current Ir: 10 uA
• Mounting Style: SMD/SMT
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 55 C
• Capacitance, Junction: 1 pF
• Current, Forward: 10 mA
• Package Type: SOT-23 (TO-236)
• Power Dissipation: 225 mW
• Primary Type: Schottky Barrier
• Temperature, Junction, Maximum: +150 °C
• Temperature, Operating: -55 to +150 °C
• Voltage, Forward: 0.6 V
• Voltage, Reverse: 7 V
• Rectifier Type: Switching Diode
• Peak Rep Rev Volt: 7V
• Rev Curr: 10uA
• Forward Voltage: 0.6V
• Operating Temp Range: -55C to 150C
• Operating Temperature Classification: Military
• Mounting: Surface Mount
• Pin Count: 3
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Max: -
• Resistance @ If, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: MMBD352LT1GOS; MMBD352LT1GOS; MMBD352LT1GOSTR

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STYLE 11:
STYLE 19:
STYLE 9:
STYLE 12:
MMBD352LT1
MMBD353LT1
MMBD354LT1
MMBD355LT1
A
A1
PIN 1. ANODE
PIN 1. CATHODE
PIN 1. ANODE
PIN 1. CATHODE
E
2. CATHODE
3. CATHODE−ANODE
2. ANODE
3. CATHODE−ANODE
2. ANODE
3. CATHODE
2. CATHODE
3. ANODE
1
3
D
e
2
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
VIEW C
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
0.8
SOLDERING FOOTPRINT*
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
L1
L
http://onsemi.com
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
q
0.25
c
3
SCALE 10:1
NOTES:
0.037
0.95
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW STANDARD 318−08.
THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM
THICKNESS OF BASE MATERIAL.
0.079
DIM
A1
H
2.0
L1
A
b
D
E
c
e
L
E
inches
mm
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
MMBD352LT1/D
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX