HSMS-280F-BLKG Avago Technologies US Inc., HSMS-280F-BLKG Datasheet
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HSMS-280F-BLKG
Specifications of HSMS-280F-BLKG
Related parts for HSMS-280F-BLKG
HSMS-280F-BLKG Summary of contents
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... These Schottky diodes are specifically designed for both analog and digital applications. This series offers a wide range of specifica tions and package con figura tions to give the designer wide flexi bility. The HSMS-280x series of diodes is optimized for high voltage applications. Note that Avago’s manufacturing techniques assure that dice found in pairs and quads are taken from adjacent sites on the wafer, assuring the highest degree of match ...
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... Operation in excess of any one of these conditions may result in permanent damage to the device +25°C, where T is defined to be the temperature at the package pins where contact is made to the circuit board Electrical Specifications T = 25°C, Single Diode A Part Package Number Marking Lead [4] HSMS Code Code Configuration 2800 A0 0 Single 2802 A2 2 Series 2803 A3 3 ...
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... where I = externally applied bias current in amps saturation current (see table of SPICE parameters temperature ideality factor (see table of SPICE parameters) Note: To effectively model the packaged HSMS-280x product, please refer to Application Note AN1124 The equivalent adjacent capacitance is the capacitance between points A and C in the figure below. This capaci- ...
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Typical Performance 25°C (unless otherwise noted), Single Diode C 100 +125C A 0 +75C +25C –25C A 0.01 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 ...
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... Avago’s family of Schottky products provides unique solutions to many design problems. The first step in choosing the right product is to select the diode type. All of the products in the HSMS-280x family use the same diode chip, and the same is true of the HSMS-281x and HSMS-282x families. Each family has a dif- ferent set of characteristics which can be compared most easily by consulting the SPICE parameters in Table 1 ...
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SMT Assembly Reliable assembly of surface mount components is a complex process that involves many material, process, and equipment factors, including: method of heating (e.g vapor phase reflow, wave soldering, etc.) circuit board material, conductor thickness and pattern, ...
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... Part Number Ordering Information No. of Part Number Devices HSMS-280x-TR2G 10000 HSMS-280x-TR1G 3000 HSMS-280x-BLKG 100 Package Dimensions Outline 23 (SOT-23 XXX SYMBOL Notes: e2 XXX-package marking E Drawings are not to scale L 7 Container 13” Reel 7” Reel antistatic bag Outline SOT-323 (SC-70 3 Lead) E XXX DIMENSIONS (mm) MIN ...
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Package Dimensions (Continued) Outline 143 (SOT-143 XXX SYMBOL Notes: E XXX-package marking L Drawings are not to scale Device Orientation ...
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Tape Dimensions and Product Orientation For Outline SOT- ° MAX A 0 DESCRIPTION SYMBOL SIZE (mm) CAVITY LENGTH A 3.15 0 WIDTH B 2.77 0 DEPTH K 1.22 0 PITCH P 4.00 BOTTOM ...
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Tape Dimensions and Product Orientation For Outlines SOT-323, -363 (CARRIER TAPE THICKNESS DESCRIPTION SYMBOL CAVITY LENGTH A 0 WIDTH B 0 DEPTH K 0 PITCH P BOTTOM HOLE DIAMETER D 1 PERFORATION ...