BAP51-03T/R NXP Semiconductors, BAP51-03T/R Datasheet - Page 2

no-image

BAP51-03T/R

Manufacturer Part Number
BAP51-03T/R
Description
Diode PIN 50V 2-Pin SOD-323 T/R
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP51-03T/R

Package
2SOD-323
Configuration
Single
Maximum Forward Current
50 mA
Maximum Forward Voltage
1.1 V
Maximum Reverse Voltage
50 V
Maximum Diode Capacitance
0.35@5V pF
Maximum Power Dissipation
500 mW
NXP Semiconductors
FEATURES
 Low diode capacitance
 Low diode forward resistance.
APPLICATIONS
 General RF applications.
DESCRIPTION
General purpose PIN diode in a SOD323 small plastic
SMD package.
ORDERING INFORMATION
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
2004 Feb 11
BAP51-03
V
I
P
T
T
F
stg
j
R
tot
General purpose PIN diode
NUMBER
SYMBOL
TYPE
continuous reverse voltage
continuous forward current
total power dissipation
storage temperature
junction temperature
NAME
PARAMETER
plastic surface mounted package; 2 leads
T
S
= 90 C
2
DESCRIPTION
PINNING
PACKAGE
CONDITIONS
Marking code: A5.
The marking bar indicates the cathode.
Fig.1 Simplified outline (SOD323) and symbol.
1
PIN
1
2
2
65
65
cathode
anode
MIN.
Product specification
DESCRIPTION
50
50
500
+150
+150
BAP51-03
MAX.
sym006
VERSION
SOD323
V
mA
mW
C
C
UNIT

Related parts for BAP51-03T/R