HSMP-3812-BLKG Avago Technologies US Inc., HSMP-3812-BLKG Datasheet - Page 5

• Manufacturer Part Number: HSMP-3812-BLKG
• Description: DIODE PIN ATTENUATOR SER SOT-23
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMP-3812-BLKG

• Diode Type: PIN - 1 Pair Series Connection
• Voltage - Peak Reverse (max): 100V
• Current - Max: 1A
• Capacitance @ Vr, F: 0.35pF @ 50V, 1MHz
• Resistance @ If, F: 3 Ohm @ 100mA, 100MHz
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Diode Case Style: SOT-23
• Capacitance Ct: 0.27pF
• Pin Configuration: Series Pair
• Reverse Recovery Time: 300ns
• Mounting Type: Surface Mount
• Breakdown Voltage: 100V
• Capacitance, Junction: 0.27 pF
• Configuration: Series
• Current, Forward: 1 A
• Package Type: SOT-23
• Primary Type: Pin
• Resistance, Thermal, Junction To Case: 500 °C/W
• Speed, Switching: RF
• Temperature, Junction, Maximum: +150 °C
• Time, Recovery: 300 ns
• Voltage, Reverse: 100 V
• Capacitance: 0.27pF
• Current Rating: 1A
• Leaded Process Compatible: Yes
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: RoHS Compliant part Electrostatic Device

Typical Applications for HSMP-481x Low Inductance Series (continued)
Co-Planar Waveguide Shunt Connection for HSMP-481x
Series
Co-Planar waveguide, with ground on the top side of the
printed circuit board, is shown in Figure 10. Since it elimi-
nates the need for via holes to ground, it offers lower shunt
parasitic inductance and higher maximum attenuation
when compared to microstrip circuit.
Figure 10. Circuit Layout.
Figure 11. Equivalent Circuit.
5
R
j
0.75 nH
0.3 pF
Co-Planar Waveguide
Center Conductor
Groundplane
Groundplane
Equivalent Circuit Model
HSMP-381x Chip*
R
C
I = Forward Bias Current in mA
R
*See AN1124 for package models.
T
T
j
=
= 2.5 + R
= C
80
I
P
0.9
+ C
Ω
j
j
2.5 Ω
R
s
* Measured at -20 V
0.18 pF*
R
C
j
j