HSMS-281L-BLKG Avago Technologies US Inc., HSMS-281L-BLKG Datasheet - Page 5

• Manufacturer Part Number: HSMS-281L-BLKG
• Description: DIODE SCHOTTKY GP LN 20V SOT-363
• Manufacturer: Avago Technologies US Inc.

Specifications of HSMS-281L-BLKG

• Diode Type: Schottky - 3 Independent
• Voltage - Peak Reverse (max): 20V
• Current - Max: 1A
• Capacitance @ Vr, F: 1.2pF @ 0V, 1MHz
• Resistance @ If, F: 15 Ohm @ 5mA, 1MHz
• Package / Case: SC-70-6, SC-88, SOT-363
• Diode Case Style: SOT-363
• No. Of Pins: 6
• Peak Reflow Compatible (260 C): Yes
• Leaded Process Compatible: Yes
• Forward Voltage: 410mV
• Repetitive Reverse Voltage Vrrm Max: 20V
• Forward Current If: 1A
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

Applications Information
Introduction — Product Selection
Avago’s family of Schottky products provides unique solu‑
tions to many design problems.
The first step in choosing the right product is to select
the diode type. All of the products in the HSMS‑282x fam‑
ily use the same diode chip, and the same is true of the
HSMS‑281x and HSMS‑280x families. Each family has a dif‑
ferent set of characteristics which can be compared most
easily by consulting the SPICE parameters in Table 1.
A review of these data shows that the HSMS‑280x family
has the highest breakdown voltage, but at the expense of
a high value of series resistance (R
do not require high voltage the HSMS‑282x family, with a
lower value of series resistance, will offer higher current
carrying capacity and better performance. The HSMS‑281x
family is a hybrid Schottky (as is the HSMS‑280x), offering
lower 1/f or flicker noise than the HSMS‑282x family.
In general, the HSMS‑282x family should be the designer’s
first choice, with the ‑280x family reserved for high volt‑
age applications and the HSMS‑281x family for low flicker
noise applications.
Table 1. Typical SPICE Parameters.
5
Parameter
B
C
E
I
I
N
R
P
P
M
BV
S
V
G
S
B
T
J0
(V
(XTI)
J
)
Units
V
pF
eV
A
A
Ω
V
HSMS-280x HSMS-281x HSMS-282x
75
1.6
0.69
1 E‑5
3 E‑8
1.08
30
0.65
2
0.5
s
). In applications which
25
1.1
0.69
1 E‑5
4.8 E‑9
1.08
10
0.65
2
0.5
15
0.7
0.69
1 E‑4
2.2 E‑8
1.08
6.0
0.65
2
0.5
Assembly Instructions
SOT-323 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑
323 (SC‑70) package is shown in Figure 6 (dimensions are
in inches). This layout provides ample allowance for pack‑
age placement by automated assembly equipment with‑
out adding parasitics that could impair the performance.
Figure 6. Recommended PCB Pad Layout for Avago’s SC70 3L/SOT-323 Products.
Assembly Instructions
SOT-363 PCB Footprint
A recommended PCB pad layout for the miniature SOT‑
363 (SC‑70, 6 lead) package is shown in Figure 7 (dimen‑
sions are in inches). This layout provides ample allowance
for package placement by automated assembly equip‑
ment without adding parasitics that could impair the per‑
formance.
0.039
Figure 7. Recommended PCB Pad Layout for Avago’s SC70 6L/SOT-363 Products.
0.039
0.026
0.026
Dimensions in inches
0.022
Dimensions in inches
0.018
0.079
0.079