MMBD701LT1 ON Semiconductor, MMBD701LT1 Datasheet - Page 4

DIODE SCHOTTKY 70V 200MW SOT23

MMBD701LT1

Manufacturer Part Number
MMBD701LT1
Description
DIODE SCHOTTKY 70V 200MW SOT23
Manufacturer
ON Semiconductor
Datasheets

Specifications of MMBD701LT1

Diode Type
Schottky - Single
Voltage - Peak Reverse (max)
70V
Capacitance @ Vr, F
1pF @ 20V, 1MHz
Power Dissipation (max)
200mW
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Capacitance
1.0 pF (Max.) @ 25°C
Capacitance, Junction
0.5 pF
Current, Forward
10 mA
Package Type
SOT-23 (TO-236)
Power Dissipation
200 mW
Primary Type
Schottky Barrier
Temperature, Junction, Maximum
+125 °C
Temperature, Operating
-55 to +125 °C
Voltage, Breakdown
70 V (Min.) @ 25°C
Voltage, Forward
0.42 V
Voltage, Repetitive Peak Reverse
70 V
Voltage, Reverse
70 V
Dc
9822
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Current - Max
-
Resistance @ If, F
-
Other names
MMBD701LT1OSCT

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PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any
liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental
damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over
time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under
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A
A1
E
1
3
D
e
2
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
H
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SEE VIEW C
0.037
0.95
0.035
0.9
0.031
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
VIEW C
PACKAGE DIMENSIONS
0.8
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
SOLDERING FOOTPRINT*
L1
L
http://onsemi.com
SOT−23 (TO−236)
CASE 318−08
ISSUE AN
q
0.25
c
4
SCALE 10:1
0.037
0.95
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
4. 318−01 THRU −07 AND −09 OBSOLETE, NEW
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
STANDARD 318−08.
STYLE 8:
0.079
DIM
PIN 1. ANODE
A1
H
2.0
L1
A
D
E
b
c
e
L
E
inches
mm
2. NO CONNECTION
3. CATHODE
MIN
0.89
0.01
0.37
0.09
2.80
1.20
1.78
0.10
0.35
2.10
MILLIMETERS
NOM
1.00
0.06
0.44
0.13
2.90
1.30
1.90
0.20
0.54
2.40
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loca
Sales Representative
MAX
1.11
0.10
0.50
0.18
3.04
1.40
2.04
0.30
0.69
2.64
0.035
0.001
0.015
0.003
0.110
0.047
0.070
0.004
0.014
0.083
MIN
INCHES
0.040
0.002
0.018
0.005
0.051
0.075
0.008
0.021
0.094
NOM
0.114
MBD701/D
0.044
0.004
0.020
0.007
0.120
0.055
0.081
0.012
0.029
0.104
MAX

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