MPN3700G ON Semiconductor, MPN3700G Datasheet

MPN3700G

Manufacturer Part Number

MPN3700G

Description

DIODE TUNING SS 200V TO92-2

Manufacturer

ON Semiconductor

Datasheet

1.MPN3700.pdf (8 pages)

Specifications of MPN3700G

Diode Type

PIN - Single

Voltage - Peak Reverse (max)

200V

Capacitance @ Vr, F

1pF @ 20V, 1MHz

Resistance @ If, F

1 Ohm @ 10mA, 100MHz

Power Dissipation (max)

280mW

Package / Case

TO-92-2, TO-226AC

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current - Max

Other names

MPN3700GOS

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applications but are also suitable for use in general–purpose switching

circuits. They are supplied in a cost–effective plastic package for

economical, high–volume consumer and industrial requirements.

They are also available in surface mount.

November, 2001 – Rev. 2

MAXIMUM RATINGS

DEVICE MARKING

ELECTRICAL CHARACTERISTICS

Reverse Voltage

Total Power Dissipation

Junction Temperature

Storage Temperature Range

MMBV3700LT1 = 4R

Reverse Breakdown Voltage

Diode Capacitance

Series Resistance (Figure 5)

Reverse Leakage Current

Reverse Recovery Time

These devices are designed primarily for VHF band switching

Optimum Reliability

I F = 10 mAdc

Long Reverse Recovery Time t rr = 300 ns (Typ)

Rugged PIN Structure Coupled with Wirebond Construction for

Low Series Resistance @ 100 MHz – R S = 0.7 Ohms (Typ) @

Reverse Breakdown Voltage = 200 V (Min)

Semiconductor Components Industries, LLC, 2001

@ T A = 25 C

Derate above 25 C

(I R = 10 Adc)

(V R = 20 Vdc, f = 1.0 MHz)

(I F = 10 mAdc)

(V R = 150 Vdc)

(I F = I R = 10 mAdc)

Rating

Characteristic

Symbol

T stg

V R

P D

T J

(T A = 25 C unless otherwise noted)

MPN3700

280

2.8

–55 to +150

+125

200

MMBV3700LT1

Symbol

V (BR)R

200

2.0

R S

C T

I R

t rr

mW/ C

Unit

Vdc

Min

200

–

Typ

300

0.7

–

CASE 318–08, STYLE 8

CASE 182–06, STYLE 1

SOT–23 (TO–236AB)

Publication Order Number:

TO–92 (TO–226AC)

Max

1.0

0.1

–

SOT–23

TO–92

MMBV3700LT1D

Unit

Vdc

Adc

Related parts for MPN3700G

MPN3700G Summary of contents

Page 1

These devices are designed primarily for VHF band switching applications but are also suitable for use in general–purpose switching circuits. They are supplied in a cost–effective plastic package for economical, high–volume consumer and industrial requirements. They are also available ...

Page 2

MMBV3700LT1 MPN3700 TYPICAL CHARACTERISTICS Figure 1. Series Resistance Figure 3. Diode Capacitance http://onsemi.com Figure 2. Forward Voltage Figure 4. Leakage Current 2 ...

Page 3

INFORMATION FOR USING THE SOT–23 SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure ...

Page 4

Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of ...

Page 5

MMBV3700LT1 MPN3700 PACKAGE DIMENSIONS SOT–23 (TO–236AB http://onsemi.com CASE 318–08 ISSUE ...

Page 6

MMBV3700LT1 MPN3700 PACKAGE DIMENSIONS TO–92 (TO–226AC http://onsemi.com CASE 182–06 ISSUE L D É É J É É SECTION X–X 6 ...

Page 7

Notes MMBV3700LT1 MPN3700 http://onsemi.com 7 ...

Page 8

... Fax: 303–675–2176 or 800–344–3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800–282–9855 Toll Free USA/Canada MMBV3700LT1 MPN3700 JAPAN: ON Semiconductor, Japan Customer Focus Center 4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031 Phone: 81–3–5740–2700 Email: r14525@onsemi.com ON Semiconductor Website: http://onsemi ...

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