C106DG ON Semiconductor, C106DG Datasheet
C106DG
Specifications of C106DG
Available stocks
Related parts for C106DG
C106DG Summary of contents
Page 1
... Sensitive Gate Triggering • Pb−Free Packages are Available* *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. © Semiconductor Components Industries, LLC, 2008 SCRs 4 A RMS, 200 − 600 Volts A MARKING DIAGRAM & ...
Page 2
... Thermal Resistance, Junction−to−Ambient Maximum Lead Temperature for Soldering Purposes 1/8 in. from Case for 10 Seconds ORDERING INFORMATION Device C106B C106BG C106D C106DG C106D1* C106D1G* C106M C106MG C106M1* C106M1G* †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D ...
Page 3
ELECTRICAL CHARACTERISTICS Characteristic OFF CHARACTERISTICS Peak Repetitive Forward or Reverse Blocking Current (V = Rated kW) AK DRM RRM GK ON CHARACTERISTICS Peak Forward On−State Voltage (Note ...
Page 4
... The dimensional diagrams below compare the critical dimensions of the ON Semiconductor C-106 package with competitive devices. It has been demonstrated that the smaller dimensions of the ON Semiconductor package make it compatible in most lead-mount and chassis-mount applications. The user is advised to compare all critical dimensions for mounting compatibility. ...
Page 5
−A− 0.25 (0.010 0.25 (0.010 PACKAGE DIMENSIONS TO−225 CASE 77−09 ISSUE Z NOTES: 1. DIMENSIONING AND ...