MCR8DSMT4G ON Semiconductor, MCR8DSMT4G Datasheet - Page 6

• Manufacturer Part Number: MCR8DSMT4G
• Description: THYRISTOR SCR 8A 600V DPAK
• Manufacturer: ON Semiconductor
• Type: SCRr

Specifications of MCR8DSMT4G

• Scr Type: Sensitive Gate
• Voltage - Off State: 600V
• Voltage - Gate Trigger (vgt) (max): 1V
• Voltage - On State (vtm) (max): 1.8V
• Current - On State (it (av)) (max): 5.1A
• Current - On State (it (rms)) (max): 8A
• Current - Gate Trigger (igt) (max): 200µA
• Current - Hold (ih) (max): 6mA
• Current - Off State (max): 10µA
• Current - Non Rep. Surge 50, 60hz (itsm): 90A @ 60Hz
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: DPak, TO-252 (2 leads+tab), SC-63
• Current - On State (it (rms) (max): 8A
• Peak Repetitive Off-state Voltage, Vdrm: 600V
• Gate Trigger Current Max, Igt: 12µA
• Current It Av: 8A
• On State Rms Current It(rms): 8A
• Peak Non Rep Surge Current Itsm 50hz: 90A
• Holding Current Max Ih: 6mA
• Rohs Compliant: Yes
• Repetitive Peak Off-state Volt: 600V
• Off-state Voltage: 600V
• Average On-state Current: 5.1A
• Hold Current: 6mA
• Gate Trigger Current (max): 200uA
• Gate Trigger Voltage (max): 1V
• Peak Reverse Gate Voltage: 18V
• Package Type: DPAK
• Peak Repeat Off Current: 10uA
• Peak Surge On-state Current (max): 90A
• On State Voltage(max): 1.8@16AV
• Mounting: Surface Mount
• Pin Count: 2 +Tab
• Operating Temp Range: -40C to 110C
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
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L3
L4
b2
e
1
b3
4
2
E
3
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
A
D
0.005 (0.13)
B
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
M
DETAIL A
0.228
5.80
C
c
L2
A
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
GAUGE
PLANE
USA/Canada
Phone: [phone]
Phone: 81−3−5773−3850
DPAK (SINGLE GAUGE)
0.244
6.20
ROTATED 90 CW
c2
http://onsemi.com
DETAIL A
H
C
L
CASE 369C−01
L1
ISSUE D
0.102
2.58
5
6
A1
0.118
3.00
0.063
1.60
H
SCALE 3:1
C
Z
SEATING
PLANE
0.243
6.17
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
2. CONTROLLING DIMENSION: INCHES.
3. THERMAL PAD CONTOUR OPTIONAL WITHIN DI-
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
5. DIMENSIONS D AND E ARE DETERMINED AT THE
6. DATUMS A AND B ARE DETERMINED AT DATUM
Y14.5M, 1994.
MENSIONS b3, L3 and Z.
FLASH, PROTRUSIONS, OR BURRS. MOLD
FLASH, PROTRUSIONS, OR GATE BURRS SHALL
NOT EXCEED 0.006 INCHES PER SIDE.
OUTERMOST EXTREMES OF THE PLASTIC BODY.
PLANE H.
STYLE 4:
DIM
A1
b2
b3
c2
L1
L2
L3
L4
PIN 1. CATHODE
A
D
E
H
b
c
e
L
Z
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
2. ANODE
3. GATE
4. ANODE
0.086
0.000
0.025
0.030
0.180
0.018
0.018
0.235
0.250
0.370
0.055
0.035
0.155
MIN
−−−
0.090 BSC
0.108 REF
0.020 BSC
INCHES
0.094
0.005
0.035
0.045
0.215
0.024
0.024
0.245
0.265
0.410
0.070
0.050
0.040
MAX
−−−
MILLIMETERS
2.18
0.00
0.63
0.76
4.57
0.46
0.46
5.97
6.35
9.40
1.40
0.89
3.93
MIN
−−−
2.29 BSC
0.51 BSC
2.74 REF
10.41
MAX
2.38
0.13
0.89
1.14
5.46
0.61
0.61
6.22
6.73
1.78
1.27
1.01
−−−
MCR8DSM/D