L717HDB44P Amphenol, L717HDB44P Datasheet - Page 132

• Manufacturer Part Number: L717HDB44P
• Description: Conn High Density D-Sub PIN 44 POS Solder Cup RA Thru-Hole 44 Terminal 1 Port
• Manufacturer: Amphenol
• Type: High Density D-Subr

Specifications of L717HDB44P

• Gender: PIN
• Termination Method: Solder Cup
• Mounting: Through Hole
• Body Orientation: Right Angle

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Amphenol InfoCom Europe | www.amphenolinfocom.eu | [e-mail] | Specifications subject to change
SFP+ “LItE”
Amphenol SFP+ Optical Transceivers are a high performance, high
density, low cost solution for 10Gb Ethernet and Fibre Channel
applications. These transceivers are multi-rate devices allowing for
a wider range of applications and backward compatibility to legacy
Fibre Channel specifications.
The transceivers feature a high reliability 850nm vertical-cavity
surface - emitting laser (VCSEL) allowing for flexible link distances
up to 200m. The module supports the latest Improved Pluggable
Formfactor specification for improved EMI performance.
Interface
Cable Options
Key Features
Applications
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20 pin board-as-connector
Duplex-LC Optical connector
OM2, OM3
I/O Connector designed for high speed differential
signal applications
Improved Pluggable FormFactor (IPF) compliant for enhanced
EMI/EMC performance
Data rates up to 11.3Gb/s, backward compatible to 1Gb/s
Support for 1x, 2x, 4x and 8x Fibre Channel data rates
Link Distances up to 200m (OM3), 50m (OM2)
High reliability and Low Power consumption
Push-to-release latch mechanism
Compliant to SFP+, SFF-8431
High capacity I/O in Storage Area Networks,
Network Attached Storage and Storage Servers
Switched fabric I/O such as ultra high bandwidth switches
and routers
Data center cabling infrastructure
High density connections between networking equipment