0750180014 Molex Inc, 0750180014 Datasheet
0750180014
Specifications of 0750180014
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0750180014 Summary of contents
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HIGH SPEED MEZZANINE BOARD TO BOARD CONNECTOR 75005 Receptacle Assembly 1.0 2.0 3.0 4.0 5.0 Appendix A - Cross Sections from Test Sequence E Appendix B - Test Setup and Components REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 ...
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HIGH SPEED MEZZANINE 1.0 Scope This document is a summary of testing done for the Molex High Speed Mezzanine connector system. The High Speed Mezzanine connector utilizes plated plastic technology to achieve high speed performance. This summary includes testing done ...
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HIGH SPEED MEZZANINE 4.0 Testing Sequences 4.1 Sample Preparation All samples were prepared and reflowed using the appropriate EIA standards and processing specifications laid out in the High Speed Mezzanine Application Specification (AS-75005-001). 4.2 EIA 364 Sequences Test or Examination ...
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HIGH SPEED MEZZANINE 4.3 Additional Testing Test or Examination Dielectric Withstanding Voltage (5.2.2) Insulation Resistance (5.2.3) Thermal Shock (5.4.1) Humidity - Temp. Cycling (5.4.4) Temperature Rise (5.4.8) Mating Force (5.3.1) Unmating Force (5.3.1) Retention Force - Chicklet to Housing (5.3.6) ...
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HIGH SPEED MEZZANINE 5.0 Testing Sequences 5.1 EIA 364-1000.01 Results Treatment After Durability After Thermal Aging Treatment After Durability After Thermal Shock After Cyclic Humidity After Reseating Treatment After Durability After Thermal Aging After Vibration REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC ...
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HIGH SPEED MEZZANINE Treatment After Durability After Thermal Aging After FMG After Thermal Disturbance After Reseating Treatment After Durability After Thermal Aging After Thermal Cycling After Reseating REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / ...
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HIGH SPEED MEZZANINE Additional Testing Results 5.2 Dielectric Withstanding Voltage Insulation Resistance Temperature Rise Treatment Mating Force Unmating Force Treatment 75003 Plug Assembly 75005 Recp Assembly REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / DOCUMENT ...
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HIGH SPEED MEZZANINE Treatment Requirement Board Thickness # of Pairs EIA 364 Test Samples 80.07 N MIN Unstressed 50% Fill Unstressed 100% Fill Unstressed 100% Fill Soldered locating Pegs Stressed 100% Fill Reworked Treatment EIA 364 Test Samples 53.37 N ...
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HIGH SPEED MEZZANINE 5.3 High Speed Electrical Testing Results Test Impedance Propagation Delay Near-End Cross Talk NEXT Bandwidth (Insertion Loss) Bandwidth (Return Loss) Note: 1) All Performance Data includes systems effects including via’s and transmission line loss ...
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HIGH SPEED MEZZANINE Impedance Pre and Post FMG Impedance Pre and Post FMG HS Mez Pair TDR @ 77 ps 10/ Mez Pair TDR @ 77 ps 10/ Mez 12 ...
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HIGH SPEED MEZZANINE Appendix A - Cross Sections from Test Sequence E Typical 75005 Solder Joint Typical 75005 Solder Joint REVISION: ECR/ECN INFORMATION: UCP2003-2204 EC No: B DATE: 2003 / DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY EIA Sequence ...
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HIGH SPEED MEZZANINE Typical 75005 Solder Joint Typical 75005 Solder Joint REVISION: ECR/ECN INFORMATION: EC No: UCP2003-2204 B DATE: 2003 / DOCUMENT NUMBER: TS-75005-001 TEST SUMMARY EIA Sequence 3 Typical 75003 Solder Joint EIA Sequence 4 Typical ...