IT1-168S-SV Hirose, IT1-168S-SV Datasheet - Page 14

• Manufacturer Part Number: IT1-168S-SV
• Description: Conn Board to Board RCP 168 POS 0.5mm Solder ST SMD Tray
• Manufacturer: Hirose
• Type: Board to Boardr

Specifications of IT1-168S-SV

• Pitch: 0.5 mm
• Number Of Rows: 2
• Number Of Contacts: 168
• Gender: RCP
• Contact Plating: Gold
• Termination Method: Solder

4. Mating Procedure
Step 1
Receptacle Placement on the board –
stationary side
Assure that the orientation posts are aligned
with the holes on the board.
When specifying receptacle assemblies without
the orientation posts exercise extra caution to
assure correct orientation and connection with
the solder pads.
Step 2
Insertion of the Transmission Module
Fully insert the Transmission Module in the
board-installed receptacle assembly.
It is critical that the insertion is done straight
and uniformly.
Step 3
Mating/un-mating
Assure that the receptacle assembly is correctly
aligned with the Transmission Module.
Fully insert the receptacle assembly on the
Transmission Module.
It is critical that the insertion is done straight
and uniformly.
Step 4
Follow the procedure described below.
Note:¡The transmission module must be fully inserted into receptacle assembly already placed and soldered to a board.
¡The Transmission Module cannot be exposed to heat temperatures of the soldering process.
IT1 Series High Speed, Matched-Impedance, Parallel Board-to-board Connector System
Connection completed
A307