BC847BPDXV6T1 ON Semiconductor, BC847BPDXV6T1 Datasheet - Page 6

• Manufacturer Part Number: BC847BPDXV6T1
• Description: TRANS NPN/PNP DUAL LP 45V SOT563
• Manufacturer: ON Semiconductor

Specifications of BC847BPDXV6T1

• Transistor Type: NPN, PNP
• Current - Collector (ic) (max): 100mA
• Voltage - Collector Emitter Breakdown (max): 45V
• Vce Saturation (max) @ Ib, Ic: 600mV @ 5mA, 100mA / 650mV @ 5mA, 100mA
• Dc Current Gain (hfe) (min) @ Ic, Vce: 200 @ 2mA, 5V
• Power - Max: 500mW
• Frequency - Transition: 100MHz
• Mounting Type: Surface Mount
• Package / Case: SOT-563, SOT-6
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Current - Collector Cutoff (max): -
• Other names: BC847BPDXV6T1OS

total design. The footprint for the semiconductor packages
must be the correct size to insure proper solder connection
the pad size. This can vary from the minimum pad size for
soldering to a pad size given for maximum power dissipa-
tion. Power dissipation for a surface mount device is deter-
mined by T
of the die, R
junction to ambient, and the operating temperature, T
Using the values provided on the data sheet for the
SOT−563 package, P
ratings table on the data sheet. Substituting these values
into the equation for an ambient temperature T
one can calculate the power dissipation of the device which
in this case is 150 milliwatts.
of the recommended footprint on a glass epoxy printed
circuit board to achieve a power dissipation of 150 milli-
watts. There are other alternatives to achieving higher
power dissipation from the SOT−563 package. Another
alternative would be to use a ceramic substrate or an
aluminum core board such as Thermal Clad
board material such as Thermal Clad, an aluminum core
board, the power dissipation can be doubled using the same
footprint.
Surface mount board layout is a critical portion of the
The power dissipation of the SOT−563 is a function of
The values for the equation are found in the maximum
The 833°C/W for the SOT−563 package assumes the use
INFORMATION FOR USING THE SOT−563 SURFACE MOUNT PACKAGE
P
J(max)
D
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
θJA
=
, the thermal resistance from the device
150°C − 25°C
, the maximum rated junction temperature
833°C/W
P
D
D
=
can be calculated as follows:
T
J(max)
R
θJA
= 150 milliwatts
− T
BC847BPDXV6T1, BC847BPDXV6T5
A
SOT−563 POWER DISSIPATION
1.35
®
A
. Using a
of 25°C,
http://onsemi.com
SOT−563
A
0.5
.
0.3
1.0
6
0.5
rated temperature of the device. When the entire device is
heated to a high temperature, failure to complete soldering
within a short time could result in device failure. There-
fore, the following items should always be observed in
order to minimize the thermal stress to which the devices
are subjected.
•
•
•
•
•
•
•
* Soldering a device without preheating can cause exces-
sive thermal shock and stress which can result in damage
to the device.
interface between the board and the package. With the
correct pad geometry, the packages will self align when
subjected to a solder reflow process.
The melting temperature of solder is higher than the
soldering should be 100°C or less.*
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When
using infrared heating with the reflow soldering
method, the difference shall be a maximum of 10°C.
260°C for more than 10 seconds.
maximum temperature gradient shall be 5°C or less.
be allowed to cool naturally for at least three minutes.
Gradual cooling should be used as the use of forced
cooling will increase the temperature gradient and
result in latent failure due to mechanical stress.
during cooling.
Always preheat the device.
The delta temperature between the preheat and
When preheating and soldering, the temperature of the
The soldering temperature and time shall not exceed
When shifting from preheating to soldering, the
After soldering has been completed, the device should
Mechanical stress or shock should not be applied
0.45
Dimensions in mm
SOLDERING PRECAUTIONS