HSDL-3201-008 Lite-On Electronics, HSDL-3201-008 Datasheet - Page 16

• Manufacturer Part Number: HSDL-3201-008
• Description: IRDA TX/RX 0.1152Mbps 3.3V 8-Pin Ultra Small Profile T/R
• Manufacturer: Lite-On Electronics
• Type: TX/RXr

Specifications of HSDL-3201-008

• Package: 8Ultra Small Profile
• Maximum Communication Distance: 30 cm
• Half Intensity Angle Degrees: 60(Max)/30(Min) °
• Maximum Data Rate: 0.1152 Mbps
• Peak Wavelength: 875/880 nm
• Pulse Width: 1.6/2.45 us
• Radiant Intensity: 9 mW/sr
• Operating Supply Voltage: 2.7 to 3.6 V

Recommended Reflow Profile
The reflow profile is a straight-line
representation of a nominal tem-
perature profile for a convective
reflow solder process. The tempera-
ture profile is divided into four process
zones, each with different DT/Dtime
temperature change rates. The DT/
Dtime rates are detailed in the above
table. The temperatures are measured
at the component to printed circuit
board connections.
In process zone P1, the PC board and
HSDL-3201 castellation I/O pins are
heated to a temperature of 160 C to
activate the flux in the solder paste.
The temperature ramp up rate, R1, is
limited to 4 C per second to allow for
even heating of both the PC board
and HSDL-3201 castellation I/O pins.
Process Zone
Heat Up
Solder Paste Dry
Solder Reflow
Cool Down
16
255
230
220
200
180
160
120
80
25
0
HEAT
R1
Symbol
P1, R1
P2, R2
P3, R3
P3, R4
P4, R5
UP
P1
50
SOLDER PASTE DRY
R2
P2
DT
25 C to 160 C
160 C to 200 C
200 C to 255 C (260 C at 10 seconds max.)
255 C to 200 C
200 C to 25 C
Process zone P2 should be of
sufficient time duration (60 to 120
seconds) to dry the solder paste. The
temperature is raised to a level just
below the liquidus point of the solder,
usually 200 C (392 F).
Process zone P3 is the solder reflow
zone. In zone P3, the temperature is
quickly raised above the liquidus
point of solder to 255 C (491 F) for
optimum results. The dwell time
above the liquidus point of solder
should be between 20 and 60
seconds. It usually takes about 20
seconds to assure proper coalescing
of the solder balls into liquid solder
and the formation of good solder
connections. Beyond a dwell time of
60 seconds, the intermetallic growth
100
t-TIME (SECONDS)
150
R3
MAX. 260°C
REFLOW
SOLDER
60 sec.
ABOVE
220°C
MAX.
P3
200
R4
DOWN
COOL
P4
R5
250
300
within the solder connections
becomes excessive, resulting in the
formation of weak and unreliable
connections. The temperature is then
rapidly reduced to a point below the
solidus temperature of the solder,
usually 200 C (392 F), to allow the
solder within the connections to
freeze solid.
Process zone P4 is the cool down
after solder freeze. The cool down
rate, R5, from the liquidus point of the
solder to 25 C (77 F) should not
exceed 6 C per second maximum.
This limitation is necessary to allow
the PC board and HSDL-3201
castellation I/O pins to change
dimensions evenly, putting minimal
stresses on the HSDL-3201 transceiver.
Maximum DT/Dtime
4 C/s
0.5 C/s
4 C/s
-6 C/s
-6 C/s