MT46V16M16CY-5B:K Micron Technology Inc, MT46V16M16CY-5B:K Datasheet - Page 88

DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.6V 60-Pin FBGA Tray

MT46V16M16CY-5B:K

Manufacturer Part Number
MT46V16M16CY-5B:K
Description
DRAM Chip DDR SDRAM 256M-Bit 16Mx16 2.6V 60-Pin FBGA Tray
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet

Specifications of MT46V16M16CY-5B:K

Density
256 Mb
Maximum Clock Rate
400 MHz
Package
60FBGA
Address Bus Width
15 Bit
Operating Supply Voltage
2.6 V
Maximum Random Access Time
0.7 ns
Operating Temperature
0 to 70 °C
Organization
16Mx16
Address Bus
15b
Access Time (max)
700ps
Operating Supply Voltage (typ)
2.6V
Package Type
FBGA
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.5V
Supply Current
260mA
Pin Count
60
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT46V16M16CY-5B:K TR
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Figure 51:
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
DDR_x4x8x16_Core2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
Case 1: t AC (MIN) and t DQSCK (MIN)
Case 2: t AC (MAX) and t DQSCK (MAX)
Command
BA0, BA1
Address
DQ
DQ
DQS
DQS
CK#
CKE
A10
DM
CK
6
6
Bank READ – with Auto Precharge
t IS
t IS
NOP
T0
t IH
1
t IH
Notes:
Bank x
IS
t IS
Row
ACT
Row
1. NOP commands are shown for ease of illustration; other commands may be valid at these
2. BL = 4.
3. The READ command can only be applied at T3 if
4. Enable auto precharge.
5.
6. DO n = data-out from column n; subsequent elements are provided in the programmed
7. Refer to Figure 35 on page 70, Figure 36 on page 71, and Figure 37 on page 72 for detailed
T1
IH
t IH
times.
t
order.
DQS and DQ timing.
t CK
RP starts only after
t RCD, t RAP 3
t RAS
t RC
NOP
T2
1
t CH
t CL
t IS
READ
Bank x
4
Col n
t
RAS has been satisfied.
T3
t IH
2,3
t LZ (MIN)
CL = 2
86
NOP
T4
t RPRE
1
t LZ (MIN)
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t RPRE
NOP
T5
t DQSCK (MIN)
DO
t DQSCK (MAX)
1
n
256Mb: x4, x8, x16 DDR SDRAM
t AC (MIN)
DO
t
n
t AC (MAX)
RAP is satisfied at T3.
T5n
t RP 5
NOP
T6
Transitioning Data
1
t HZ (MAX)
T6n
t RPST
©2003 Micron Technology, Inc. All rights reserved.
t RPST
NOP
T7
1
Operations
Don’t Care
Bank x
ACT
T8
Row
Row

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