MT47H32M16HR-25E IT:G Micron Technology Inc, MT47H32M16HR-25E IT:G Datasheet - Page 10
MT47H32M16HR-25E IT:G
Manufacturer Part Number
MT47H32M16HR-25E IT:G
Description
32MX16 DDR2 SDRAM PLASTIC IND TEMP PBF FBGA 1.8V
Manufacturer
Micron Technology Inc
Datasheet
1.MT47H32M16HR-25E_ITG.pdf
(131 pages)
Specifications of MT47H32M16HR-25E IT:G
Lead Free Status / Rohs Status
Compliant
- Current page: 10 of 131
- Download datasheet (10Mb)
Automotive Temperature
General Notes
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. Q 10/10 EN
The automotive temperature (AT) option, if offered, has two simultaneous require-
ments: ambient temperature surrounding the device cannot be less than –40°C or
greater than +105°C, and the case temperature cannot be less than –40°C or greater
than +105°C. JEDEC specifications require the refresh rate to double when T
+85°C; this also requires use of the high-temperature self refresh option. Additionally,
ODT resistance and the input/output impedance must be derated when T
+85°C.
• The functionality and the timing specifications discussed in this data sheet are for the
• Throughout the data sheet, the various figures and text refer to DQs as “DQ.” The DQ
• Complete functionality is described throughout the document, and any page or dia-
• Any specific requirement takes precedence over a general statement.
DLL-enabled mode of operation.
term is to be interpreted as any and all DQ collectively, unless specifically stated oth-
erwise. Additionally, the x16 is divided into 2 bytes: the lower byte and the upper byte.
For the lower byte (DQ0–DQ7), DM refers to LDM and DQS refers to LDQS. For the
upper byte (DQ8–DQ15), DM refers to UDM and DQS refers to UDQS.
gram may have been simplified to convey a topic and may not be inclusive of all
requirements.
10
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
Functional Description
© 2004 Micron Technology, Inc. All rights reserved.
C
is < 0°C or >
C
exceeds
Related parts for MT47H32M16HR-25E IT:G
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
IC DDR2 SDRAM 512MBIT 84FBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
IC DDR2 SDRAM 512MBIT 3NS 84FBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
DRAM Chip DDR2 SDRAM 512M-Bit 32Mx16 1.8V 84-Pin FBGA T/R
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
MICMT47H32M16HR-3_IT:F 32MBX16 DDR2
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
32MX16 DDR2 SDRAM PLASTIC IND TEMP PBF FBGA 1.8V
Manufacturer:
Micron Technology Inc
Part Number:
Description:
IC DDR2 SDRAM 512MBIT 84FBGA
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet:
Part Number:
Description:
Manufacturer:
Micron Technology Inc
Datasheet: