MT48H8M16LFB4-75 IT:K Micron Technology Inc, MT48H8M16LFB4-75 IT:K Datasheet - Page 76

DRAM Chip Mobile SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA Tray

MT48H8M16LFB4-75 IT:K

Manufacturer Part Number
MT48H8M16LFB4-75 IT:K
Description
DRAM Chip Mobile SDRAM 128M-Bit 8Mx16 1.8V 54-Pin VFBGA Tray
Manufacturer
Micron Technology Inc
Type
Mobile SDRAMr
Datasheet

Specifications of MT48H8M16LFB4-75 IT:K

Package
54VFBGA
Density
128 Mb
Address Bus Width
14 Bit
Operating Supply Voltage
1.8 V
Maximum Clock Rate
133 MHz
Maximum Random Access Time
8|5.4 ns
Operating Temperature
-40 to 85 °C
Organization
8Mx16
Address Bus
14b
Access Time (max)
8/5.4ns
Operating Supply Voltage (typ)
1.8V
Package Type
VFBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.95V
Operating Supply Voltage (min)
1.7V
Supply Current
70mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
AUTO REFRESH Operation
PDF: 09005aef832ff1ea
128mb_mobile_sdram_y35M.pdf - Rev. G 10/09 EN
The AUTO REFRESH command is used during normal operation of the device to refresh
the contents of the array. This command is nonpersistent, so it must be issued each
time a refresh is required. All active banks must be precharged prior to issuing an AUTO
REFRESH command. The AUTO REFRESH command should not be issued until the min-
imum
internal refresh controller. This makes the address bits “Don’t Care” during an AUTO
REFRESH command.
After the AUTO REFRESH command is initiated, it must not be interrupted by any exe-
cutable command until
NOP commands must be issued on each positive edge of the clock. The SDRAM re-
quires that every row be refreshed each
REFRESH command—calculated by dividing the refresh period (
rows to be refreshed—meets the timing requirement and ensures that each row is re-
freshed. Alternatively, to satisfy the refresh requirement a burst refresh can be em-
ployed after every
the number of rows to be refreshed at the minimum cycle rate (
t
RP is met following the PRECHARGE command. Addressing is generated by the
t
REF period by issuing consecutive AUTO REFRESH commands for
128Mb: 8 Meg x 16, 4 Meg x 32 Mobile SDRAM
t
RFC has been met. During
76
Micron Technology, Inc. reserves the right to change products or specifications without notice.
t
REF period. Providing a distributed AUTO
t
RFC time, COMMAND INHIBIT or
AUTO REFRESH Operation
©2008 Micron Technology, Inc. All rights reserved.
t
RFC).
t
REF) by the number of

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