MT48LC32M16A2TG-75:C Micron Technology Inc, MT48LC32M16A2TG-75:C Datasheet - Page 62

• Manufacturer Part Number: MT48LC32M16A2TG-75:C
• Description: DRAM Chip SDRAM 512M-Bit 32Mx16 3.3V 54-Pin TSOP-II Tray
• Manufacturer: Micron Technology Inc
• Type: SDRAMr

Specifications of MT48LC32M16A2TG-75:C

• Density: 512 Mb
• Maximum Clock Rate: 133 MHz
• Package: 54TSOP-II
• Address Bus Width: 15 Bit
• Operating Supply Voltage: 3.3 V
• Maximum Random Access Time: 6|5.4 ns
• Operating Temperature: 0 to 70 °C
• Organization: 32Mx16
• Address Bus: 15b
• Access Time (max): 6/5.4ns
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: 0C to 70C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 115mA
• Pin Count: 54
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Not Compliant

Figure 46:
PDF: 09005aef809bf8f3/Source: 09005aef80818a4a
512MbSDRAM.fm - Rev. L 10/07 EN
DQML, DQMH
COMMAND
A11, A12
BA0, BA1
A0–A9,
DQM/
CLK
CKE
A10
DQ
t CMS
t CKS
t AS
t AS
t AS
ACTIVE
T0
ROW
ROW
BANK
WRITE – With Auto Precharge
t CMH
t CKH
t AH
t AH
t AH
Notes:
t RCD
t RAS
t RC
t CK
T1
NOP
1. For this example, BL = 4.
2. x16: A11 and A12 = “Don’t Care”; x8: A12 = “Don’t Care.”
ENABLE AUTO PRECHARGE
t CMS
t CL
COLUMN
t DS
WRITE
T2
BANK
D
IN
t CMH
t CH
t DH
m
m
2
t DS
D
IN
T3
NOP
m + 1
t DH
t DS
D
T4
IN
NOP
m + 2
t DH
62
t DS
D
T5
IN
NOP
m + 3
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t DH
t WR
T6
NOP
512Mb: x4, x8, x16 SDRAM
T7
NOP
©2000 Micron Technology, Inc. All rights reserved.
Timing Diagrams
t RP
NOP
T8
ACTIVE
ROW
ROW
BANK
T9
Don’t Care