109100518 Lineage Power, 109100518 Datasheet - Page 21

• Manufacturer Part Number: 109100518
• Description: Module DC-DC 1-OUT 0.75V to 4V 5A 5-Pin SMT T/R
• Manufacturer: Lineage Power
• Type: Non-Inverting|Inverting|Step Up|Step Downr

Specifications of 109100518

• Package: 5SMT
• Output Current: 5 A
• Output Voltage: 0.75 to 4 V
• Input Voltage: 3 to 5.8 V
• Number Of Outputs: 1

Data Sheet
October 2, 2009
Surface Mount Information
Lead Free Soldering
The –Z version Austin MicroLynx SMT modules are
lead-free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices)
for both Pb-free solder profiles and MSL
classification procedures. This standard provides a
recommended forced-air-convection reflow profile
based on the volume and thickness of the package
(table 4-2). The suggested Pb-free solder paste is
Sn/Ag/Cu (SAC). The recommended linear reflow
profile using Sn/Ag/Cu solder is shown in Fig. 38.
MSL Rating
The Austin MicroLynx SMT modules have a MSL
rating of 1.
Storage and Handling
The recommended storage environment and
handling procedures for moisture-sensitive surface
mount packages is detailed in J-STD-033 Rev. A
(Handling, Packing, Shipping and Use of
Moisture/Reflow Sensitive Surface Mount Devices).
Moisture barrier bags (MBB) with desiccant are
required for MSL ratings of 2 or greater. These
LINEAGE
POWER
3.0 – 5.8Vdc input; 0.75Vdc to 4.0Vdc Output; 5A output current
(continued)
Austin MicroLynx
sealed packages should not be broken until time of
use. Once the original package is broken, the floor
life of the product at conditions of ≤ 30°C and 60%
relative humidity varies according to the MSL rating
(see J-STD-033A). The shelf life for dry packed
SMT packages will be a minimum of 12 months
from the bag seal date, when stored at the
following conditions: < 40° C, < 90% relative
humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Board Mounted Power
Modules: Soldering and Cleaning Application Note
(AN04-001).
Figure 38. Recommended linear reflow profile
using Sn/Ag/Cu solder.
300
250
200
150
100
50
0
TM
Per J-STD-020 Rev. C
Heating Zone
SMT Non-isolated Power Modules:
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
21