CC109104931 Lineage Power, CC109104931 Datasheet - Page 18

• Manufacturer Part Number: CC109104931
• Description: Module DC-DC 1-OUT 0.7525V to 3.63V 10A 6-Pin SMT T/R
• Manufacturer: Lineage Power
• Type: Non-Inverting|Inverting|Step Up|Step Downr

Specifications of CC109104931

• Package: 6SMT
• Output Current: 10 A
• Output Voltage: 0.7525 to 3.63 V
• Input Voltage: 3 to 5.5 V
• Number Of Outputs: 1
• Switching Regulator: Yes

Data Sheet
October 2, 2009
Surface Mount Information
Pick and Place
The Austin Lynx
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and location of manufacture.
Figure 35. Pick and place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and pick &
placement speed should be considered to optimize
this process. The minimum recommended nozzle
diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the
allowable component spacing, is 12 mm max.
Tin Lead Soldering
The Austin Lynx
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
LINEAGE
o
C. Typically, the eutectic solder melts at 183
POWER
TM
TM
SMT modules use an open frame
SMT power modules are lead free
o
C. The label also carries
3.0 – 5.5Vdc Input; 0.75Vdc to 3.63Vdc Output; 10A output current
o
C,
Austin Lynx
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 35. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 36. Time Limit Curve Above 205
for Tin Lead (Sn/Pb) process.
300
200
240
235
230
225
220
205
200
250
100
215
210
150
50
0
TM
0
SMT Non-isolated Power Modules:
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
40
T
205
lim
o
above
C
o
Co o ling
zo ne
1 -4
C Reflow
50
o
Cs
-1
18
60