CC109107050 Lineage Power, CC109107050 Datasheet - Page 23

• Manufacturer Part Number: CC109107050
• Description: Module DC-DC 1-OUT 3.3V 20A 8-Pin 1/8-Brick
• Manufacturer: Lineage Power
• Type: Step Downr

Specifications of CC109107050

• Package: 81/8-Brick
• Output Current: 20 A
• Output Voltage: 3.3 V
• Input Voltage: 48 V
• Number Of Outputs: 1
• Switching Regulator: Yes

Data Sheet
August 13, 2010
Surface Mount Information (continued)
Tin Lead Soldering
The recommended linear reflow profile using Sn/Pb
solder is shown in Figure 49 and 50. For reliable
soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 49. Recommended Reflow Profile for Sn/Pb
Solder.
Figure 50. Time Limit, T
Reflow .
Lead Free Soldering
The –Z version SMT modules of EQW series are
lead-free (Pb-free) and RoHS compliant and are
compatible in a Pb-free soldering process. Failure to
observe the instructions below may result in the
failure of or cause damage to the modules and can
adversely affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
LINEAGE
300
200
250
240
235
230
225
220
205
200
215
210
100
150
50
0
0
POWER
10
Heat zo ne
max 4
P reheat zo ne
max 4
20
P eak Temp 235
REFLOW TIME (S)
o
Cs
TIME LIMIT (S)
o
So ak zo ne
30-240s
Cs
-1
lim
-1
, Curve Above 205
30
o
C
40
T
205
lim
o
above
36 - 75Vdc Input; 1.2Vdc to 5Vdc Output; 12A to 25A Output
C
EQW012/020/023/025 Series, Eighth-Brick Power Modules:
50
Co o ling
zo ne
1 -4
o
Cs
o
-1
C
60
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Fig. 51.
Figure 51. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The EQW series SMT modules have a MSL rating of
2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of  30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
23