CC109135984 Lineage Power, CC109135984 Datasheet - Page 19

• Manufacturer Part Number: CC109135984
• Description: Module DC-DC 1-OUT 0.75V to 2V 20A 7-Pin SMT
• Manufacturer: Lineage Power
• Type: Step Downr

Specifications of CC109135984

• Package: 7SMT
• Output Current: 20 A
• Output Voltage: 0.75 to 2 V
• Input Voltage: 2.4 to 3.63 V
• Number Of Outputs: 1
• Switching Regulator: Yes

Data Sheet
October 2, 2009
Surface Mount Information
Pick and Place
The Austin SuperLynx II
frame construction and are designed for a fully
automated assembly process. The modules are fitted
with a label designed to provide a large surface area
for pick and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and the location of manufacture.
Figure 27. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The Austin SuperLynx II
lead free modules and can be soldered either in a
lead-free solder process or in a conventional Tin/Lead
(Sn/Pb) process. It is recommended that the
customer review data sheets in order to customize the
solder reflow profile for each application board
assembly. The following instructions must be
observed when soldering these units. Failure to
LINEAGE
POWER
TM
TM
o
C. The label also carries
SMT modules use an open
SMT power modules are
2.4 – 3.63Vdc input; 0.75Vdc to 2.0Vdc Output; 20A output current
Austin SuperLynx II
observe these instructions may result in the failure of
or cause damage to the modules, and can adversely
affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 28. Reflow Profile for Tin/Lead (Sn/Pb)
process
Figure 29. Time Limit Curve Above 205
Tin/Lead (Sn/Pb) process
o
300
200
250
240
235
230
225
220
205
200
215
210
100
C. Typically, the eutectic solder melts at 183
150
50
TM
0
0
SMT Non-isolated Power Modules:
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
T
205
40
lim
o
above
C
o
Co o ling
zo ne
1 -4
C for
50
o
Cs
-1
o
19
60
C,