LCMXO1200C-3FTN256I LATTICE SEMICONDUCTOR, LCMXO1200C-3FTN256I Datasheet - Page 26
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LCMXO1200C-3FTN256I
Manufacturer Part Number
LCMXO1200C-3FTN256I
Description
CPLD MachXO Family 600 Macro Cells 1.8V/2.5V/3.3V 256-Pin FTBGA Tray
Manufacturer
LATTICE SEMICONDUCTOR
Datasheet
1.LCMXO1200C-3FTN256I.pdf
(96 pages)
Specifications of LCMXO1200C-3FTN256I
Package
256FTBGA
Family Name
MachXO
Number Of Macro Cells
600
Maximum Propagation Delay Time
5.1 ns
Number Of User I/os
211
Typical Operating Supply Voltage
1.8|2.5|3.3 V
Ram Bits
9420.8
Memory Type
SRAM
Operating Temperature
-40 to 100 °C
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
LCMXO1200C-3FTN256I
Manufacturer:
LATTICE
Quantity:
120
Company:
Part Number:
LCMXO1200C-3FTN256I
Manufacturer:
Lattice Semiconductor Corporation
Quantity:
10 000
Lattice Semiconductor
Figure 2-22. MachXO Configuration and Programming
Density Shifting
The MachXO family has been designed to enable density migration in the same package. Furthermore, the archi-
tecture ensures a high success rate when performing design migration from lower density parts to higher density
parts. In many cases, it is also possible to shift a lower utilization design targeted for a high-density device to a
lower density device. However, the exact details of the final resource utilization will impact the likely success in
each case.
Port
Mode
Program in seconds
Memory Space
Non-Volatile
Background
ISP 1149.1 TAP Port
microseconds
Download in
Power-up
Refresh
2-23
SRAM Memory
Space
1532
MachXO Family Data Sheet
Configure in milliseconds
Architecture