XC2C128-7TQ144I Xilinx Inc, XC2C128-7TQ144I Datasheet - Page 14
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XC2C128-7TQ144I
Manufacturer Part Number
XC2C128-7TQ144I
Description
CPLD CoolRunner™-II Family 3K Gates 128 Macro Cells 152MHz 0.18um (CMOS) Technology 1.8V 144-Pin TQFP EP
Manufacturer
Xilinx Inc
Datasheet
1.XC2C32A-6QFG32C.pdf
(16 pages)
Specifications of XC2C128-7TQ144I
Package
144TQFP EP
Family Name
CoolRunnerÂ-II
Device System Gates
3000
Number Of Macro Cells
128
Maximum Propagation Delay Time
7.5 ns
Number Of User I/os
100
Number Of Logic Blocks/elements
8
Typical Operating Supply Voltage
1.8 V
Maximum Operating Frequency
152 MHz
Number Of Product Terms Per Macro
40
Operating Temperature
-40 to 85 °C
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC2C128-7TQ144I
Manufacturer:
XILINX
Quantity:
1 400
Part Number:
XC2C128-7TQ144I
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
CoolRunner-II CPLD Family
Absolute Maximum Ratings
Quality and Reliability Parameters
Warranty Disclaimer
THESE PRODUCTS ARE SUBJECT TO THE TERMS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED
AT http://www.xilinx.com/warranty.htm. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF THE
PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED ON THE
THEN-CURRENT XILINX DATA SHEET FOR THE PRODUCTS. PRODUCTS ARE NOT DESIGNED TO BE FAIL-SAFE
AND ARE NOT WARRANTED FOR USE IN APPLICATIONS THAT POSE A RISK OF PHYSICAL HARM OR LOSS OF
LIFE. USE OF PRODUCTS IN SUCH APPLICATIONS IS FULLY AT THE RISK OF CUSTOMER SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
Further Reading
Application Notes
http://www.xilinx.com/support/documenta-
tion/application_notes/xapp784.pdf
(Bulletproof Design Practices)
http://www.xilinx.com/support/documentation/application_no
tes/xapp375.pdf
http://www.xilinx.com/support/documentation/application_no
tes/xapp376.pdf
14
Notes:
1.
2.
3.
4.
Notes:
1.
Symbol
Stresses above those listed might cause malfunction or permanent damage to the device. This is a stress rating only. Functional
operation at these or any other condition above those indicated in the operational and programming specification is not implied.
The chip supply voltage should rise monotonically.
Maximum DC undershoot below GND must be limited to either 0.5V or 10 mA, whichever is easier to achieve. During transitions, the
device pins might undershoot to –2.0V or overshoot to 4.5 V, provided this overshoot or undershoot lasts less than 10 ns and with the
forcing current being limited to 200 mA. The I/O voltage can never exceed 4.0V.
For soldering guidelines and thermal considerations, see the
packages, see XAPP427.
ESD is measured to 2000V using the human body model. Pins exposed to this limit can incur additional leakage current to
a maximum of 10 μA when driven to 3.9V.
V
T
N
ESD
DR
PE
Symbol
V
T
T
V
CC
T
STR
J
I
(3)
A
(4)
(2)
(Timing Model)
(Logic Engine)
Data retention
Program/erase cycles (Endurance)
Electrostatic discharge(1)
Supply voltage relative to GND
Input voltage relative to GND
Ambient Temperature (C-grade)
Ambient Temperature (I-grade)
Maximum junction temperature
Storage temperature
Parameter
Parameter
www.xilinx.com
Device Packaging
(1)
http://www.xilinx.com/support/documenta-
tion/application_notes/xapp317.pdf
(Power Evaluation Equation for CoolRunner-II CPLDs)
http://www.xilinx.com/support/documentation/application_no
tes/xapp377.pdf
http://www.xilinx.com/support/documentation/application_no
tes/xapp378.pdf
http://www.xilinx.com/support/documentation/application_no
tes/xapp379.pdf
http://www.xilinx.com/support/documentation/application_no
tes/xapp380.pdf
information on the Xilinx website. For Pb-free
1,000
2,000
Min
20
(Low Power Design)
(Advanced Features)
(High Speed Design)
(Cross Point Switch)
–0.5
–0.5
DS090 (v3.1) September 11, 2008
Min.
–40
–40
–65
Max
0
-
-
-
Product Specification
Cycles
Max.
150
150
Units
Years
Volts
2.0
4.0
70
85
Unit
°C
°C
°C
°C
V
V
R