XC2S50E-6PQG208C Xilinx Inc, XC2S50E-6PQG208C Datasheet - Page 84

• Manufacturer Part Number: XC2S50E-6PQG208C
• Description: FPGA Spartan®-IIE Family 50K Gates 1728 Cells 357MHz 0.15um Technology 1.8V 208-Pin PQFP
• Manufacturer: Xilinx Inc
• Series: Spartan™-IIEr

Specifications of XC2S50E-6PQG208C

• Package: 208PQFP
• Family Name: Spartan®-IIE
• Device Logic Cells: 1728
• Device Logic Units: 384
• Device System Gates: 50000
• Maximum Internal Frequency: 357 MHz
• Typical Operating Supply Voltage: 1.8 V
• Maximum Number Of User I/os: 146
• Ram Bits: 32768
• Number Of Logic Elements/cells: 1728
• Number Of Labs/clbs: 384
• Total Ram Bits: 32768
• Number Of I /o: 146
• Number Of Gates: 50000
• Voltage - Supply: 1.71 V ~ 1.89 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 208-BFQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1330

Spartan-IIE FPGA Family: Pinout Tables
FG456 Pinouts (XC2S100E, XC2S150E, XC2S200E, XC2S300E, XC2S400E, XC2S600E)
84
I/O, L#N
I/O, L#P
I/O, L#N
I/O, L#P
I/O, L#N
I/O, VREF
Bank 2,
L#P
I/O
I/O, L#N
I/O, L#P
I/O
I/O, L#N
I/O, L#P
I/O, L#N
I/O, L#P
I/O
I/O (DIN,
D0),
L#N_YY
I/O (DOUT,
BUSY),
L#P_YY
CCLK
TDO
TDI
I/O (CS),
L#P_YY
Function Bank
Pad Name
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
-
G21
G20
G19
G18
E22
E21
D22
D21
E20
E19
D20
C22
C21
B22
A21
C19
B20
F21
F20
F19
F18
Pin
200E, 300E,
200E, 300E,
150E, 200E,
300E, 400E,
200E, 300E,
200E, 300E,
200E, 300E,
XC2S200E,
400E, 600E
XC2S200E,
400E, 600E
XC2S150E,
XC2S150E,
XC2S150E,
400E, 600E
XC2S150E,
400E, 600E
XC2S100E,
XC2S150E,
400E, 600E
XC2S100E,
XC2S100E,
XC2S200E,
300E, 400E
XC2S200E,
300E, 400E
XC2S100E
Async.
Output
Option
LVDS
300E
300E
600E
600E
600E
All
All
All
-
-
-
-
-
XC2S200E,
400E, 600E
XC2S600E
Option
300E,
V
All
REF
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
I/O, L23P_Y
I/O, L22P_Y
I/O (DOUT,
I/O, VREF
I/O, L25N
I/O, L24N
L21N_YY
L21P_YY
L20P_YY
I/O, L25P
I/O (DIN,
I/O (CS),
L23N_Y
L22N_Y
Bank 2,
BUSY),
CCLK
100E
L24P
TDO
D0),
TDI
I/O,
I/O,
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I/O
-
-
-
-
-
-
I/O, L32P_Y
I/O, L30P_Y I/O, L32P_Y I/O, L32P_Y I/O, L32P_Y I/O, L32P_Y
I/O (DOUT,
I/O, VREF
I/O, L33N
I/O, L33P
I/O, L29N
I/O, L29P
I/O, L28N
I/O, L28P
L27N_YY
L27P_YY
L26P_YY
I/O (DIN,
I/O (CS),
L32N_Y
L31N_Y
L30N_Y
L31P_Y
Bank 2,
BUSY),
CCLK
150E
TDO
D0),
I/O,
I/O,
I/O,
TDI
I/O
-
-
Device-Specific Pinouts: XC2S
I/O, L35P_Y
I/O, L30P_Y I/O, L30P_Y I/O, L30P_Y
I/O (DOUT,
I/O, VREF
I/O, VREF
I/O, L34N
L29N_YY
L29P_YY
L28P_YY
I/O, L34P
I/O (DIN,
I/O (CS),
L35N_Y
L33N_Y
L33P_Y
L32N_Y
L31N_Y
L31P_Y
L30N_Y
Bank 2,
Bank 2,
BUSY),
CCLK
200E
TDO
D0),
TDI
I/O,
I/O,
I/O,
I/O,
I/O,
I/O
-
-
I/O, L34P_Y
I/O (DOUT,
I/O, VREF
I/O, VREF
I/O, L35N
I/O, L35P
L29N_YY
L29P_YY
L28P_YY
I/O (DIN,
I/O (CS),
L34N_Y
L33N_Y
L32N_Y
L31N_Y
L30N_Y
L33P_Y
L31P_Y
Bank 2,
Bank 2,
BUSY),
CCLK
300E
TDO
D0),
I/O,
I/O,
I/O,
I/O,
I/O,
TDI
I/O
I/O
I/O
DS077-4 (2.3) June 18, 2008
I/O, L35P_Y I/O, L35P_Y
I/O (DOUT,
I/O, VREF
I/O, VREF
I/O, L34N
I/O, L31N
L29N_YY
L29P_YY
L28P_YY
I/O, L34P
I/O (DIN,
I/O (CS),
L35N_Y
L33N_Y
L33P_Y
L32N_Y
L30N_Y
Bank 2,
Bank 2,
BUSY),
Product Specification
CCLK
400E
L31P
TDO
D0),
TDI
I/O,
I/O,
I/O,
I/O,
I/O
I/O
I/O
I/O (DOUT,
I/O, VREF
I/O, VREF
I/O, VREF
I/O, L34N
I/O, L34P
I/O, L30N
I/O, L30P
L29N_YY
L29P_YY
L28P_YY
I/O (DIN,
I/O (CS),
L35N_Y
L33N_Y
L32N_Y
L31N_Y
L33P_Y
L31P_Y
Bank 2,
Bank 2,
Bank 2,
BUSY),
CCLK
600E
TDO
D0),
I/O,
I/O,
I/O,
TDI
I/O
I/O
I/O
R