XC3S1200E-4FTG256C Xilinx Inc, XC3S1200E-4FTG256C Datasheet - Page 11

• Manufacturer Part Number: XC3S1200E-4FTG256C
• Description: FPGA Spartan®-3E Family 1.2M Gates 19512 Cells 572MHz 90nm (CMOS) Technology 1.2V 256-Pin FTBGA
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S1200E-4FTG256C

• Package: 256FTBGA
• Family Name: Spartan®-3E
• Device Logic Cells: 19512
• Device Logic Units: 2168
• Device System Gates: 1200000
• Number Of Registers: 17344
• Maximum Internal Frequency: 572 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 190
• Ram Bits: 516096
• Number Of Logic Elements/cells: 19512
• Number Of Labs/clbs: 2168
• Total Ram Bits: 516096
• Number Of I /o: 190
• Number Of Gates: 1200000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 256-LBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1529; XC3S1200E-4FTG256C

DS312-2 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
IDDRIN1
IDDRIN2
OTCLK1
OTCLK2
ICLK1
ICLK2
IDDRIN1/IDDRIN2 signals shown with dashed lines connect to the adjacent IOB in a differential pair only, not to the FPGA fabric.
All IOB control and output path signals have an inverting polarity option wihtin the IOB.
TCE
OCE
REV
IQ1
ICE
IQ2
T1
T2
SR
O1
O2
T
I
R
D
CE
CK
D
CE
CK
D
CE
CK
D
CE
CK
D
CE
CK
D
CE
CK
SR
SR REV
SR
SR REV
SR
SR REV
REV
REV
REV
Q
Q
Q
Q
Q
Q
Figure 5: Simplified IOB Diagram
TFF1
TFF2
OFF1
OFF2
IFF1
IFF2
Programmable
Programmable
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DDR
MUX
DDR
MUX
Delay
Delay
Three-state Path
Input Path
Output Path
Program-
Output
mable
Driver
Single-ended Standards
LVCMOS, LVTTL, PCI
Differential Standards
using V REF
Functional Description
Pull-Up
Down
Pull-
Keeper
Latch
DS312-2_19_110606
V
Pin
I/O Pin
from
Adjacent
IOB
ESD
ESD
V
REF
CCO
I/O
Pin
11