XC3S200AN-4FT256C Xilinx Inc, XC3S200AN-4FT256C Datasheet - Page 77

• Manufacturer Part Number: XC3S200AN-4FT256C
• Description: FPGA Spartan®-3AN Family 200K Gates 4032 Cells 667MHz 90nm Technology 1.2V 256-Pin FTBGA
• Manufacturer: Xilinx Inc

Specifications of XC3S200AN-4FT256C

• Package: 256FTBGA
• Family Name: Spartan®-3AN
• Device Logic Units: 4032
• Device System Gates: 200000
• Maximum Internal Frequency: 667 MHz
• Typical Operating Supply Voltage: 1.2 V
• Maximum Number Of User I/os: 195
• Ram Bits: 294912

User I/Os by Bank
Table 69
The AWAKE pin is counted as a dual-purpose I/O.
Table 69: User I/Os Per Bank for the XC3S50AN in the TQG144 Package
Footprint Migration Differences
The XC3S50AN FPGA is the only Spartan-3AN device offered in the TQG144 package. The XC3S50AN FPGA is pin
compatible with the Spartan-3A XC3S50A FPGA in the TQ(G)144 package, although the Spartan-3A FPGA requires an
external configuration source.
DS557 (v4.1) April 1, 2011
Product Specification
Top
Right
Bottom
Left
Package
Edge
Total
indicates how the 108 available user-I/O pins are distributed between the four I/O banks on the TQG144 package.
I/O Bank
0
1
2
3
Maximum I/Os
108
27
25
30
26
I/O
14
11
15
42
2
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INPUT
1
0
0
1
2
All Possible I/O Pins by Type
Spartan-3AN FPGA Family: Pinout Descriptions
DUAL
21
26
1
4
0
VREF
3
2
1
2
8
CLK
30
8
8
6
8
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